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Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China
Business Type:
Trading Company
Main Products:
Die Bonder , Wire Bonding , Laser Marking(ID IC Wafer) , Laser Grooving , Laser Cutting , ...
Number of Employees:
11
Year of Establishment:
2019-09-12
Plant Area:
83 square meters
Average Lead Time:
Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months
OEM/ODM Service
Overseas Agent / Branch
Visit My Factory

Die Bonder, Wire Bonding manufacturer / supplier in China, offering High Production Efficiency Nitrogen-Filled Oxygen-Free Ovens Are Designed for Durability and High Performance, Nitrogen-Filled Oxygen-Free Ovens Semiconductor Equipment with Controllable Heating Rate, Semiconductor Industry Pi Curing Oxygen-Free Oven Machine for Flexible Circuit Board Printing and so on.

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Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.

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Company Profile

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Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd.
Book a Factory Tour
Business Type: Trading Company
Main Products: Die Bonder , Wire Bonding , Laser Marking(ID IC Wafer) , Laser Grooving , Laser Cutting , ...
Number of Employees: 11
Year of Establishment: 2019-09-12
Plant Area: 83 square meters
Average Lead Time: Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months
Info marked by is verified by BV

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!

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