Die Bonder, Wire Bonding manufacturer / supplier in China, offering Gxf Series Femtosecond Laser 515nm Green Femtosecond Laser 1030nm IR Femtosecond Laser 343nm UV Femtosecond Laser, Gxp Series Picosecond Laser 5W/10W/15W UV Picosecond Laser 30W/40W/60W/90W UV Picosecond Laser 10W/20W/30W/40W/60W Green Picosecond Laser, 15W/20W UV Nanosecond Laser and so on.
Suppliers with verified business licenses
Business Type: | Trading Company | |
Main Products: | Die Bonder , Wire Bonding , Laser Marking(ID IC Wafer) , Laser Grooving , Laser Cutting , ... | |
Number of Employees: | 11 | |
Year of Establishment: | 2019-09-12 | |
Plant Area: | 83 square meters | |
Average Lead Time: |
Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
"Intelligent equipment + Internet industry", We focus on ...