Product Description
Wafer Marking
1. Product compatible size: 8-12 inch ring crystal cage;
2. Equipped with a crystal loading system that supports Cassette loading;
3. Robot robotic arm transmission;
4. Automatic calibration of crystal center and angle
5. The product can be positioned on the front and marked with transparent film on the back;
6. Can receive customer marking mapping data;
7. It is not necessary to network the customer company's system and support the SECS/GEM function;
Mapping diagram
8. Optional air cleaning system FFU and smoke and dust collection and filtration system.
SEMI: 5x9 single line density/10x18 double line density
Arial font
Barcode BC-412 SEMI T1
QR code QR DM (optional)
Support customization
Main technical parameters of the equipment
Control system galvanometer square head+control card, Windows 7/10
Laser wave length 532nm
Laser cooling method: water cooling
Support file formats dxf, plt
Power supply single-phase 220V, 4KW (excluding smoke and dust filter)
Dual arm robotic arm parameters
Arm rotation lifting
Maximum range 315 mm * 340 ° 300 mm*
Average handling speed 570 mm/sec 220 °/sec 200 mm/sec
Maximum handling speed 1140 mm/sec 270 °/sec 250 mm/sec
Accuracy below 12.6 µ m 0.0045 ° 6.25 µ m
Handling height 620mm * (height from the fixed surface of the base to the crystal mounting surface on the finger)
Repeatability accuracy within ± 0.1mm
Compatibility of wafer size with material fingers: 8-12 inches
Cleanliness ISO Class 2 (under independent exhaust conditions inside the drive structure)
Factory power supply: DC24V ± 10% 16A; Vacuum: better than -53kPa
(Bernoulli suction cup uses compressed air, with an adjustable pressure of 0.5MPa)
Finger A: Take the crystal from the material box and place it on the calibrator;
Picking finger B: Remove the crystal cage from the temple edge implement and place it in the material box.
Edge Finder Parameters
SEMI lattice confinement of the transported object
(Customized designs can be made according to the shape and material of special crystal craters)
Wafer size compatibility 8-12 inches
Time required for position determination to locate the crystal center: 3 seconds
Position accuracy crystal center: within ± 0.1 mm
Sensor LED lighting+image recognition sensor for detecting crystal boundary edges
Wafer size switching command control mode/communication mode
Cleanliness ISO Class 2 (under independent exhaust conditions inside the drive structure)
Factory power supply: DC24V ± 10% 3A; Vacuum: better than -53kPa
(Bernoulli suction cup uses compressed air, with an adjustable pressure of 0.5MPa)
FFU performance parameters
Power supply single-phase 220V/50Hz
Power 120 W
Wind speed 0.45 m/s ± 20%
Air volume 950 m ³/ H
Noise 50-58 dB
Level EN779 H14
Efficiency MPPS 99.997%
Dust collector parameters
External dimensions (mm) 640 × five hundred and fifty × one thousand three hundred and twenty-two
Weight (kg) 105
Maximum air volume (m ³/ h) 265
Maximum negative pressure (mbar) 230
Rated power (kW) 2.2
Voltage (V/Hz) 220/50
Control protection external control&digital display pressure&alarm output
Noise (dB) 70 ± 2
Exhaust pipe diameter (mm) φ seventy-five
Filtering efficiency ≥ 99% 0.3 µ m
Manual cleaning method (automatic beep reminder)
Environmental requirements
Working environment: 20 ºC~25 ºC (with air conditioning installed and controlled indoor temperature environment stable at 2 ºC)
Transportation environment -25~55 ºC
Working humidity 35-60%, no condensation
Power demand single-phase 220VAC, 50HZ, 32A
Power grid fluctuation < ± 10%
The grounding wire of the power grid meets the national standard requirements of the computer room
Grounding wire grounding resistance < 4 Ω
Quantitative cooling water for laser, purified water (for laser cooling)
Dust extraction and exhaust duct ≥ 265m3/H
Compressed air ≥ 150L/min, pressure 0.5-0.7MPa, fan suction required
(Compressed air should be dehydrated and degreased before passing through an air dryer before entering the equipment)
Please avoid using in the following places:
Places with a lot of garbage, dust, and oil mist;
Places with high vibrations and impacts;
Places that can reach drugs and flammable and explosive substances;
Places near high-frequency interference sources;
Places prone to condensation.
Exhibition & Customers
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Packaging & Shipping
FAQ
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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