Silicon Carbide Wafer Laser Processing System

Product Details
Customization: Available
After-sales Service: 1 Year
Warranty: 1 Year
Gold Member Since 2023

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  • Silicon Carbide Wafer Laser Processing System
  • Silicon Carbide Wafer Laser Processing System
  • Silicon Carbide Wafer Laser Processing System
  • Silicon Carbide Wafer Laser Processing System
  • Silicon Carbide Wafer Laser Processing System
  • Silicon Carbide Wafer Laser Processing System
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  • Overview
  • Product Description
  • Packaging & Shipping
  • Our Partner
  • After Sales Service
Overview

Basic Info.

Model NO.
HMLA-8680
Laser Type
Solid-State Laser
Lader-Power
≥30W
X Axes
Stroke 560mm, Resolution 0.1μm
Y Axes
Stroke 430mm, Resolution 0.1μm
Z Axes
Stroke 55mm, Resolution 0.5μm
Theta Axis
Travel 360°, Resolution 0.001°
Maximum Cut Ingot Thickness
50mm
Transport Package
Wooden Case
Specification
0*0*0
Trademark
none
Origin
China

Product Description


 
Product Description
Silicon Carbide Wafer Laser Processing System
The system is used for laser slicing processing of silicon carbide ingots/pieces. After the laser processing is completed, it is used with an auxiliary dicing device to complete wafer dicing after slicing. The material loss is small, while the processing efficiency is high. No consumables are required to operate the equipment, and the processing cost is low. It applied to wafer slicing processing of silicon carbide ingots (pieces)


Advantages

 1. Low material loss

 2. High processing efficiency

 3. No consumables are required to operate the equipment

 4. Low processing cost



Equipment Parameters
 
Laser types solid-state laser
Laser power
≥30W
Cooling Type
Closed-circulating water cooling
X axes Stroke 560mm, resolution 0.1 μ m
Y axes Stroke 430mm, resolution 0.1 μ m
Z axes Stroke 55mm, resolution 0.5 μ m
Theta axis Travel 360°, resolution 0.001°
Maximum cut ingot thickness 50mm
Loading and unloading method Fully automatic
Cutting shaft speed 0-1000mm/s
Laser processing loss 110-150 μ m (6 inches, 380 μ m thickness)
Processing efficiency
25min / pcs (6 inches, 380 μ m thickness)

Samples
Silicon Carbide Wafer Laser Processing System
 
Packaging & Shipping

 

Silicon Carbide Wafer Laser Processing System

 
Our Partner



Silicon Carbide Wafer Laser Processing System

After Sales Service

 

Silicon Carbide Wafer Laser Processing System
 

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