4/6/8-Inch Wafer Production Sic Laser Annealing Equipment with a Vacuum Cracking System

• Customization: Available
• Function: High Temperature Resistance
• Demoulding: Automatic
• Model NO.: Himalaya-13
• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Desktop
• Driven Type: Pneumatic
• Transport Package: Complies with International Logistics Standards
• Origin: China
• Production Capacity: 10000

Product Description

Product Description

This device is suitable for the cutting scheme of SIC wafers

Application field: Development of mature silicon carbide laser internal modification cutting equipment
A high-precision and high-efficiency cutting equipment for silicon carbide materials.
Main features:
Fully compatible with 4/6/8-inch wafer production;
Adopting efficient imported lasers, the process effect is stable;
Carrying a DRA self tracking system, the focus can be adjusted in real-time according to the thickness of the film,
CCD carries infrared imaging and has forward and backward cutting functions;
Equipped with a vacuum cracking system for small grain products to ensure film expansion yield.

Clamp from Cassette to the center position for alignment and wide-angle alignment
Pick when taking photos of contours
After taking photos, the Upper arm picks up and transports the material to the upper material position
Chuck Table moved to processing position for Laser Process
The processed Wafer is sent to the cutting position
Lower arm moves the processed pieces back to the center position
Clamp will transport the processed pieces back to Cassette

Processing process: Cutting cracks (using a chopping knife or vacuum) and expanding the film

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.