High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding Attach

Product Details
Customization: Available
After-sales Service: Provided
Condition: New
Gold Member Since 2023

Suppliers with verified business licenses

Audited Supplier

Audited by an independent third-party inspection agency

QA/QC Inspectors
The supplier has 1 QA and QC inspection staff
R&D Capabilities
The supplier has 1 R&D engineers, you can check the Audit Report for more information
to see all verified strength labels (14)
  • High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding Attach
  • High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding Attach
  • High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding Attach
  • High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding Attach
  • High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding Attach
  • High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding Attach
Find Similar Products
  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Precision
High Precision
Certification
ISO
Warranty
12 Months
Automatic Grade
Automatic
Product Name
Semiconductor Equipment
Feature 1
Guaranteed Quality
Feature 2
Customized According to Needs
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description

 

High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding Attach
  • DA1201 IC Linear High Precision Die Attach

    Wafer size: 6"- 12";

    Dual dispensing system;

    High-precision linear driven bond head;

    Support DAF function;

    Multifunction work table, suitable for different kinds of lead frames & substrates;

    High-precision wafer table with highly accurate die rotation system and motorized wafer expansion system;

    Intelligent dispensing control system to realize precision glue volume control;

    Missing die detection and re-picking function;

    Programmable Pick / Bond Force;

    Customization for special design is also available.

High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding Attach

High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding AttachHigh Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding AttachHigh Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding Attach
Exhibition & Customers

High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding AttachHigh Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding AttachJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

High Speed Precision Automatic Semiconductor Equipment to IC Package Wafer Die Bond Die Bonding Attach
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now
Contact Supplier