5W Marking Machine Flying Fiber Laser Marker for Plastic/Cable Tube Wire Production Line Printing

• After-sales Service: Provided
• Warranty: Provided
• Laser Visibility: Visible
• Applicable Material: Metal
• Laser Wavelength: Fiber Laser
• Laser Classification: Semiconductor Laser
• Product Name: Flying Marking Machine
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

 

Product Description

Brief Description

UV series products can be used on most materials on normal 3rd level flight marking, especially useful on materials like: plastic, PE Bottle, package bag, PVC pipe line, etc. It is also used for data communication marking.

Main Parameter

Item	Parameter
Wavelength	355nm
Power	≥5W
Working Frequency	8-200KHz
Minimum Code Width	0.15mm
Minimum Character Size	0.40mm
Repeatability Accuracy	±0.01mm
Standard Marking Range	100mm×100mm
Standard Focal Length	186±2mm(From laserhead baseboard to focus area)
Optional Marking Range	60mm×60mm to 360mm×360 mm
Nominal Line Speed	≥10000mm/s
Printing Code	>700 Chars/Sec
Power Requirement	AC 220V/50HZ/10A
Overall Power Consumption	Peak≤1.5KW,Average≤0.75KW
Cooling Mode	Thermostat water cooling
Level of Protection	IP54
Cable Length	3m
Machine Size	main beam:611.5mm×162mm×189mm
	main control cabinet:512mm×220mm×456mm
	Water cooler:270mm×315mm×305mm
	lifting platform:450mm×450mm×1100mm(Customized)

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.