Semiconductor Equipment Ultrasonic Wire Bonder

Product Details
Customization: Available
After-sales Service: Online Service
Function: High Temperature Resistance
Gold Member Since 2023

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  • Semiconductor Equipment Ultrasonic Wire Bonder
  • Semiconductor Equipment Ultrasonic Wire Bonder
  • Semiconductor Equipment Ultrasonic Wire Bonder
  • Semiconductor Equipment Ultrasonic Wire Bonder
  • Semiconductor Equipment Ultrasonic Wire Bonder
  • Semiconductor Equipment Ultrasonic Wire Bonder
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Field Application
  • Packaging & Shipping
  • After Sales Service
  • FAQ
Overview

Basic Info.

Model NO.
HMLA-LS10
Demoulding
Automatic
Condition
New
Certification
ISO
Warranty
12 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Mould Life
300,000-1,000,000 Shots
Wire Cutter
Front Cut/ Rear Cut
Max Wire Length
Realtime Monitoring
Dimensions
960*1400*1700mm
Transport Package
Air Freight
Specification
0*0*0
Trademark
Himalaya
Origin
China
Production Capacity
200

Product Description

Product Description
 


Semiconductor Equipment Ultrasonic Wire BonderSemiconductor Equipment Ultrasonic Wire Bonder

 

Exhibition & Customers

Semiconductor Equipment Ultrasonic Wire Bonder

Field Application

 

Semiconductor Equipment Ultrasonic Wire Bonder
Packaging & Shipping
Semiconductor Equipment Ultrasonic Wire BonderSemiconductor Equipment Ultrasonic Wire BonderSemiconductor Equipment Ultrasonic Wire Bonder

 

After Sales Service

 

Semiconductor Equipment Ultrasonic Wire Bonder

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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