High End Semiconductor Wafer Saw Machine

• Function: High Temperature Resistance
• Demoulding: Automatic
• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Model NO.: Himalaya-23
• Installation: Desktop
• Driven Type: Electric
• Mould Life: >1,000,000 Shots
• Product Name: Semiconductor Wafer Saw Machine
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• OEM/ODM Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China
• Production Capacity: 1111

Product Description

Product Description

It can be widely used in Silicon wafers, GaAs, GaN, Glass, Sic, PCB board , QFN, DFN, Pottery and porcelain etc.

X axis	maximum effective input rang of feed speed	310mm 0.1-1000mm/s	310mm	210mm
			0.1-1000mm/s	0.1-600mm/s
Y axis	max effective	310mm	310mm	170mm
	single step increment	0.0001mm	0.0001mm	0.0001mm
	reach accuracy	0.003mm/310mm	0.003mm/310mm	0.003mm/170mm
Z axis	maximum effective	40mm	40mm	40mm
	repetition accuracy	0.001mm	0.001mm	0.001mm
	maximum cutter diameter	58	58	58
T axis	maximum rotation angle	380°	380°	380°
spindle	speed range	6000-60000rpm	6000-60000rpm	6000-60000rpm
	output power	1.8KW(2.4KW)	1.8KW(2.4KW)	1.5KW (2.4KW)
power		AC380V±10%	AC380V±10%	AC380V±10%
Size W×D×H		1200mm×1629mm×1849mm	1080mm×1160mm×1800mm	630mmx900mmx1600mm

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.