| Customization: | Available |
|---|---|
| Wavelength: | 355nm/532nm |
| Pulse Width: | <15PS |
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| MODEL | GXP 355-5 | GXP 355-10 | GXP 355-15 |
| Wavelength | 355nm | ||
| Pulse Repetition Rate Range | 50kHz - 2MHz | 100kHz - 2MHz | |
| Pulse Width | <15ps | ||
| Average Power | >5W@100kHz | >10W@500kHz | >15W@500kHz |
| Average Power Stability | <±3% over 24 hours | ||
| Pulse-to-Pulse Stability | <3%rms | ||
| Spatial Mode | TEM00(M2 <1.3) | ||
| Beam Divergence Full Angle | < 2mrad | ||
| 1/e2 Beam Diameter | 1.5±0.2mm | ||
| Beam Roundness | >90% | ||
| Beam Pointing Stability | <50urad | ||
| Polarization Direction | Horizontal | ||
| Polarization Ratio | 100:1 | ||
| Cooling | Water-cooling | ||
The precise machining system of UV picosecond laser is a sort of machine applied in the fields of mechanical, basic subjects of engineering and technology science, materials science and mechanical engineering. Owing to the development of the picosecond fundamental frequency laser of high beam quality and high power, the power of UV picosecond laser has reached the level of 50W and the output records is constantly being broken. The continuously improved property of new nonlinear crystals has made great contributions to the stability and working lifetime of high power UV picosecond laser.
There are two removal ways when the laser is used for micro processing. The first way is the light and heat effect hat it the high energy laser is as a heat source to quickly heat the material and vaporize it, achieving the goal of removing material. The second way is the photochemical effect that the laser has enough high peak energy to break molecular bonds of material in the moment of touch and the material has been removed before the heat is accumulated. Compared to nanosecond laser, picosecond laser has shorter pulse width and higher peak power. The pulses of this kind of ultra fast laser can achieve a very ideal result of laser"cold"processing especially the pulse width in around 10ps. The wavelength of UV picosecond laser is even shorter and photon energy is higher. Thus smaller processing size and higher machining accuracy can be gained with UV picosecond laser.
Currently UV picosecond laser has quite obvious advantages in the aspects of organic polymer film metal thin film processing and the heat-affected zone of most applications can be controlled within 20µm or less.
Picosecond laser cutting machine is a kind of high precise cutting device used for metal and non-metallic thin material cutting. The cutting precision can reach micron level and is a way of cold processing with no burnt and rolled edge. It is widely used in the industries which has high requirements on cutting like aerospace, automotive manufacturing, medical treatment and consumer electronics. Good cutting effect, high efficiency, high precision has gained UV picosecond laser a lot of favors in different industries.
The film material has very broad application in different industries and it can be divided into PET film, PI film, PP film and other plastic film and composite film of transparent material. UV picosecond laser cutting machine can be used for the precise cutting, drilling and etching of thin film materials and cutting, etching, trimming of composite film materials, achieving the full cut and half cut of covering film.
The ceramic material is often used as the base material and has higher requirements on cutting in electronics industry. The cutting and clipping of alumina or zirconia ceramic substrate can be easily completed by picosecond laser cutting machine. picosecond laser cutting machine has significant advantage on aesthetics and accuracy.
As the most widely used material in electronics industry, there are always higher requirements on the cutting accuracy and efficiency pf circuit board. The picosecond laser cutting machine can accomplish the precise cutting and splitting of the circuit board under 6mm thickness of different materials and substrates such as PCB, FR4, reinforcing steel, FPC, rigid-Flex Board, glass fiber board and etc.
Thin metal refers to metal materials under 0.2mm thickness like copper foil, aluminum foil, stainless steel, alloy materials and etc. The glass material is mainly 3C thin glass and processed by UV picosecond cutting machines will have no burrs, low carbonization, no deformation and small chipping. It has realized precise cutting and is used in the industries like parts, and photovoltaic copper foil.
| MODEL | GXP 355-30 | GXP 355-40 | GXP 355-60 | GXP 355-90 |
| Wavelength | 355nm | |||
| Pulse Repetition Rate Range | 100kHz - 2MHz | |||
| Pulse Width | <15ps | |||
| Average Power | >30W@1MHz | >40W@1MHz | >60W@1MHz | >90W@1MHz |
| Average Power Stability | <±3% over 24 hours | |||
| Pulse-to-Pulse Stability | <3%rms | |||
| Spatial Mode | TEM00(M2 <1.3) | |||
| Beam Divergence Full Angle | < 2mrad | |||
| 1/e2 Beam Diameter | 2.0±0.2mm | 2.5±0.2mm | ||
| Beam Roundness | >90% | |||
| Beam Pointing Stability | <50urad | |||
| Polarization Direction | Horizontal | |||
| Polarization Ratio | 100:1 | |||
| Cooling | Water-cooling | |||
Compared with nanosecond laser, the pulse width of picosecond laser is shorter especially the laser pulses less than 10ps has no thermal damage when processing materials which is called as "cold processing", widely used in precision machining field. UV Picosecond laser has shorter wavelength, higher Photon Energy and smaller focus spot. The UV photon of high energy directly breaks the molecular bond of material and will not generate the hot melt process of IR laser. As a result, the processing size can be smaller and machining accuracy has been further improved.
The pulse time of picosecond laser cutting machine is particularly short and the single pulse duration is only a few picoseconds. Therefore, the thermal effect is very small and even negligible. With respect to the processing of laser cutting machine, there is no need to recast material during whole process and the process is clean. And the absorption of laser energy is not affected by material and wavelength. Accordingly, picosecond laser cutting machine and femtosecond Laser cutting machine of ultra fast laser processing system have broad space in the field of micro precise laser processing. Picosecond laser cutting machine has larger application market than nanosecond laser cutting machine such as solar cells, OLED laser cutting, OLED laser cutting, brittle material drilling and etc. Compared to the thermal range and effects of material in nanosecond range , picosecond laser almost has no thermal effect and has better result. At the same time, it also just needs shorter time but higher accuracy and faster processing speed.
Although now there is mainly nanosecond laser cutting machine for laser cutting machine, micro-precision laser processing equipment must be applied in more industries as the precise cutting technology is developing rapidly and the requirements for laser cutting equipment are becoming higher and higher.
Picosecond laser cutting machine is mainly composed of picosecond laser, laser guide, displacement platform, focusing system, computer control system and other auxiliary systems. Picosecond laser is the ultra-short pulse laser of high peak value. The principle is that the laser beam is emitted to the workpiece after focusing and the instantaneous energy heats the material to melt or evaporate them.
| MODEL | GXP 532-10 | GXP 532-20 | GXP 532-30 | GXP 532-40 | GXP 532-60 |
| Wavelength | 532nm | ||||
| Pulse Repetition Rate Range | 50kHz - 2MHz | 100kHz - 2MHz | |||
| Pulse Width | <15ps | ||||
| Average Power | >10W@100kHz | >20W@500kHz | >30W@1MHz | >40W@1MHz | >60W@1MHz |
| Average Power Stability | <±3% over 24 hours | ||||
| Pulse-to-Pulse Stability | <3%rms | ||||
| Spatial Mode | TEM00(M2 <1.3) | ||||
| Beam Divergence Full Angle | < 2.0mrad | ||||
| 1/e2 Beam Diameter | 2.0±0.2mm | 2.5±0.2mm | 2.4±0.2mm | ||
| Beam Roundness | >90% | ||||
| Beam Pointing Stability | <50urad | ||||
| Polarization Direction | Vertical | ||||
| Polarization Ratio | >100:1 | ||||
| Operating Voltage | 100-240VAC | ||||
| Cooling | Water-cooling | ||||
Green picosecond laser is applicable for semiconductor and photovoltaic industry, macromolecular material processing, cardiovascular stent processing, catheter manufacturing, artificial limb manufacturing and etc.
Picosecond laser refers to the laser with adjustable picosecond pulse width and repetition frequency. Compared with nanosecond laser, the picosecond pulse width is on the order of picosecond, the repetition frequency on the order of kilohertz and the pulse width on the order of nanosecond. Our GXP series green picosecond laser has superior beam quality, compact structure, reliable performance, high work efficiency, high brightness and small focusing spot. It is mainly in semiconductor and photovoltaic industries, macromolecular materials processing and etc.
The semiconductor industry is only an important economic pillar of a country but also one of the important symbols of a country's scientific and technological level as well as comprehensive national strength. China has the world's largest semiconductor production base but many semiconductor companies have introduced advanced technology and equipment with high energy pulse outputs at picosecond or nanosecond level from abroad.
The photovoltaic industry is an emerging industry which converts light energy into electrical energy through solar cells. As a national strategic emerging industry, it has the characteristics of a wide range of products, long industrial chain, a wide range of applications and high scientific and technological content. It has become the most dynamic and potential component of China's new energy industries. At present, the world's largest photovoltaic industry system has been built in China. However, it is now facing the problems such as overcapacity, fierce market competition, low product technology and high production costs. With the advancement of technology and improvement of management level, the photovoltaic industry will have larger space for development.
With the development of our country's economy and society and improvement of people's living standards, people's requirements for life quality are getting higher and higher. Due to the increasingly serious problems of pollution and environmental destruction which is caused by traditional material processing technologies, people have put forward higher requirements for material processing and handling. Macromolecular material is a typical renewable resource of the characteristics of renewable, non-polluting and recyclable. With the enhancement of people's environmental awareness, the processing and handling technology of macromolecular materials has been applied more widely and deeply. Macromolecular material processing and handling technology refers to the laser technology of cutting, punching, welding, polishing, etching and modification.
Here are the advantages of processing by green picosecond laser.
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