• High Precision Positioning Wafer Laser Marking Equipment for Si Wafer/Bonded Wafer/Sic/Saphire
  • High Precision Positioning Wafer Laser Marking Equipment for Si Wafer/Bonded Wafer/Sic/Saphire
  • High Precision Positioning Wafer Laser Marking Equipment for Si Wafer/Bonded Wafer/Sic/Saphire
  • High Precision Positioning Wafer Laser Marking Equipment for Si Wafer/Bonded Wafer/Sic/Saphire
  • High Precision Positioning Wafer Laser Marking Equipment for Si Wafer/Bonded Wafer/Sic/Saphire
  • High Precision Positioning Wafer Laser Marking Equipment for Si Wafer/Bonded Wafer/Sic/Saphire

High Precision Positioning Wafer Laser Marking Equipment for Si Wafer/Bonded Wafer/Sic/Saphire

Condition: New
Warranty: 12 Months
Automatic Grade: Automatic
Installation: Vertical
Driven Type: Electric
Product Name: Wafer Laser Marking
Customization:
Gold Member Since 2023

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Jiangsu, China
QA/QC Inspectors
The supplier has 1 QA and QC inspection staff
R&D Capabilities
The supplier has 1 R&D engineers, you can check the Audit Report for more information
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Feature 1
Multi-Dust Processing
Feature 2
Auto Detection of Marking Effects
OEM/ODM Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
High Precision Positioning Wafer Laser Marking Equipment for Si Wafer/Bonded Wafer/Sic/Saphire
Product Features
  • High precision laser processing&depth control

  • Auto sample transfer, high precision positioning

  • Auto detection of marking effects

  • Multi-dust processing,Max. control of particle size



 

Application
Si wafer, Bonded wafer, SiC/Saphire
wafer laser marking
Technical specification  
Laser wavelength 355/532nm
Laser power 10W/15W@355nm, 15W/30W@532nm
Wafer Positioning Accuracy ±0.1mm
Marking repeatability ±20μm
Single point diameter 45-80μm
roundness >95%
Wafer size 6 inch, 8 inch, 12 inch
Font Standard SIMI font
Exhibition & Customers

High Precision Positioning Wafer Laser Marking Equipment for Si Wafer/Bonded Wafer/Sic/SaphireHigh Precision Positioning Wafer Laser Marking Equipment for Si Wafer/Bonded Wafer/Sic/SaphireJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

High Precision Positioning Wafer Laser Marking Equipment for Si Wafer/Bonded Wafer/Sic/Saphire
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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