Ceramic Laser Drilling/Dicing Equipment for Precision Drilling, Cutting Andscribing of Alumina/Aluminiumnitride/Zirconium Oxide/Siliconnitride

• After-sales Service: Provided
• Warranty: 12 Months
• Driven Type: Pneumatic
• Product Name: Ceramic Laser Drilling/Dicing
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

    Product Features

• High peak power fiber laser.Stable and reliable. Long service life

• Laser waveform segmentation editing patented technology

• One machine for multiple applications of drilling, cutting and scribing,reducing cost of use

• Single and double head, manual/automatic loading and unloading

• Support multi-feature CCD visual positioning
   

  Application
  Precision drilling, cutting and
  scribing of alumina/aluminium
  nitride/zirconium oxide/silicon
  nitride, etc.

Technical specification
Laser wavelength	1064nm/532nm/355nm
Laser power	10-30W
Positioning accuracy	±5μm
Marking depth	0.008-0.2mm adjustable
Min. character	0.18mm
Repeat Positioning Accuracy	±3μm
UPH	≥50 plates/hr
Max. loading volume at one time	Standard material box 4 boxes, 80mm wide

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.