| Customization: | Available |
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| After-sales Service: | Provided |
| Condition: | New |
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PI curing oxygen-free oven is used for special process requirements of PI, BCB, LCP curing and baking, photoresist curing, and electronic ceramic material drying. It is suitable for semiconductor manufacturing, COB packaging, medical and health care, flexible circuit board printing, precision mold annealing, etc. Oxidation-free drying and baking process requirements of the industry.
Nitrogen-filled oxygen-free ovens are designed for durability and high performance, using a high-capacity horizontal air recirculation system to maximize temperature uniformity and its performance, ideal for industrial baking equipment, widely used in the semiconductor and electronics industries .PI curing oxygen-free oven is used for special process requirements of PI, BCB, LCP curing and baking, photoresist curing, and electronic ceramic material drying. It is suitable for semiconductor manufacturing, COB packaging, medical and health care, flexible circuit board printing, precision mold annealing, etc. Oxidation-free drying and baking process requirements of the industry.
Features
1. The heating rate is controllable, the process curve is set, and the operation is one-key; the auxiliary cooling shortens the cooling time and improves the production efficiency; the low-oxygen environment can be achieved, and the curing effect is better.
2. One-way horizontal air transport is adopted in the box, strong pressure air is supplied in the 2-side air duct, and high-density punched air panels are used on the 2 sides of the air duct to precisely control the angle of the deflector to ensure the uniformity of the temperature in the box.
3. High-precision temperature controller, PID adjustment, control accuracy of 0.1 degrees Celsius, programmable touch screen controller, and attached with over-temperature automatic power-off and alarm circuit, reliable control and safe use.
4. The pressure reducing valve and double flow meter nitrogen saving system can save nitrogen consumption in anaerobic and hypoxic environments.
5. Using high-power high-temperature-resistant long-shaft motor and large-diameter stainless steel turbine blades, it can work stably for a long time in high temperature environment.
6. The interior of the oven is made of stainless steel, and the inside of the oven is continuously filled with nitrogen, so that the working chamber of the oven is in a low-oxygen and clean state.
7, Strong application functions, aging, annealing, testing, curing, drying, solvent, paint and paint curing, stress relief, etc.
PRODUCT PARAMETERS
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model |
YH-OXY-02-C |
YH-OXY-02-B |
YH-OXY-02-A |
|
Oxygen content range |
1-5 percent |
500-2000PPM |
Less than or equal to 100PPM |
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temperature range |
Room temperature -300 degrees Celsius |
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control precision |
±1 degree Celsius |
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temperature uniformity |
±2 percent (no load) |
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heating power |
6KW |
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working size (highwidthdeep) |
910620620(mm) |
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External dimensions (highwidthdeep) |
17508551030(mm) |
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volume |
350L |
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High-efficiency filtration (optional) |
HEPA high efficiency filter |
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Heating rate |
The heating rate is adjustable, and the no-load room temperature rises to 175 degrees Celsius for about 20 minutes |
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Cooling rate (optional) |
Water cooling, 30-40min cooling from 150 degrees Celsius to within 70 degrees Celsius Air cooling, 70-90min to cool down from 150 degrees Celsius to within 70 degrees Celsius |
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Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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