Product Description
Introduction:
Marking of SLOT form IC products suitable for packaging segments in the semiconductor industry
Mark relevant information such as serial number, product name, batch number, etc. on the specific location of the plastic sealed IC
The specific string corresponding to the information.
Modular design to meet different process requirements
Compatibility design to meet different sizes and specifications of products
Specifications:
Magazine feeding capacity: maximum 4In -4Out
Slot Magazine width range: 35-110 mm
Slot Magazine length range: 150-310 mm
Slot Magazine height range: 120-150 mm
Strip length (L) range: 140~300 mm
Strip width (W) range: 30~100 mm
After interruption of marking, the material sheet flows out to the NG material box
Marking and lifting single step action
Add touch screen anti touch function
Equipped with sampling and single cycle functions
Equipped with display function for each cylinder action
• Feeding station setting feeding quantity function
Automatic feeding after 5 consecutive empty material pushing, with the ability to set the number of times independently
Complete LOG records can automatically save log information
Change the program that is paused during operation, and then press again to continue running
• Manual automatic switching function
After switching the program, the track automatically adjusts to the new station
• Single loop function added
Program interface button help function
Set the number of material boxes and clear printing information when reaching the set value
Display of marking time for adding material boxes
Manual single step operation program for processing section
Automatically exit to the operator after setting the time for high-level permissions
Add debugging with one button feeding and one button returning function
Support MES Mark module system
• Mark Auto download
Automatic generation of printing information
Support for Mark 2D functionality
Automatically read Mapping to distinguish printing defects
Support for LOT END printing clearance function
Support for scanning and replacing text
Automatic text alignment with fixed text width
Add chip position editing and display functions
It is possible to offset the position and angle of two heads separately
Can adjust the position and angle of a single material
Support for special array layout function
The software supports automatic font alignment and centering functions
Support for special array editing functions
The software supports automatic energy reading and correction functions
Function E * H
Laser self produced, IPG, Germany
Laser wavelength 1064nm 1064nm
Number of lasers 1 2
Laser energy 30W 20W+20W
Laser pulse width QCW type laser with 8 adjustable pulse width modes (4-200ns)
Processing line width 60-100um 60-100um
Processing depth 20 ± 10um 20 ± 10um
Processing material Compound Compound si
Processing range (180x320) mm (180x320) mm
Processing accuracy ± 75um ± 75um
Comparison of processing effects
Maximum printing speed Printing speed: 800mm/s
Jump speed: 5000mm/s
Printing speed: 1000mm/s
Jump speed: 9000mm/s
Compatible product warpage < 5mm (long edge) < 6mm (long edge)
The consistency of co printing has passed the client ICOS check and meets the conditions for co printing
Function E * H
Product compatibility is compatible with lengths of 150-300mm and widths of 30-100mm
product
Compatible with lengths of 150-300mm and widths of 30-100mm
product
Product loading method Material box type Material box type
Product transportation method: Material transfer type (single track) Belt type (single track)
Laser and optical path E * laser+CTI galvanometer IPG laser+German SCANLAB galvanometer
Pre and post marking dust removal and electrostatic removal brush+electrostatic removal brush+ion rod electrostatic removal brush+ion fan
The dust extraction structure uses an internal dust extractor to exhaust 380V, and an external dust extractor to filter out toxic gases
discharge
Product misplacement collection, misplacement, and detection of defective products flow through the belt to the corresponding location
position
It does not affect the operation of the equipment, and there are errors and defective products detected
Remove the mechanism and display information on the touch screen
Laser focus adjustment axis Z-axis automatic lifting Z-axis control lifting
Marking position: Product lifting cylinder, lifting screw module, lifting, abnormal focus, fast through software
adjustment
Visual anti daze function, compatible with different products for visual anti daze, and compatible with different products
Product positioning method: positioning hole positioning+visual CCD positioning hole positioning+visual precision positioning
Product inspection Visual inspection Visual inspection
Equipment safety protective cover and other safety measures Protective cover and other safety measures
Adjustable printing depth according to customer requirements, with clear handwriting
Service designers abroad, communication unchanged, Chinese independent research and development, fast and effective
The software is basically fixed and difficult to modify according to customer preferences and requirements
Name Parameter Remarks
External dimensions
(W * L * H)
2850mm x 1500 x 1750mm
Floor size 4400mm x 3500mm x 2500mm
Weight ≈ 1800Kg
The fluctuation of ambient temperature between 20 and 25 ºC is less than ± 2 ºC
Environmental humidity of 40%~60% without condensation
source
AC 220/380V ± 5%
/50Hz/50A
Good grounding, grounding
Resistance<4 ohms
Power 15KW
Compressed air 0.6-0.8MPa
2 quick connect connectors (equipped with
φ 10mm gas pipe)
Dust extraction φ 100mm interface
Connect with customer central net
Chemical system
Avoid installing the vibration source VC-B on the punching machine
Near the isoseismic source
Environmental smoke and dust Class 6 (ISO) or above
Exhibition & Customers
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Packaging & Shipping
FAQ
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
Audited Supplier 
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