High End Semiconductor Industry Glass Wafer Laser Processing Equipment

• After-sales Service: Provided
• Function: High Temperature Resistance
• Demoulding: Automatic
• Condition: Used
• Certification: ISO
• Warranty: 12 Months
• Model NO.: Himalaya-30
• Automatic Grade: Automatic
• Installation: Desktop
• Driven Type: Electric
• Mould Life: >1,000,000 Shots
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Using ultrafast laser processing technology for precision drilling of brittle materials Fully automatic loading and unloading design, suitable for large-scale production Using PEEK fixtures and engineering plastic suction cups to reduce surface scratches on the product

The product is automatically fed into the material box and waste is automatically collected Low cost 24/7 telephone technical support
Test material thickness mm, hole type and size mm, laser process plan processing quality and efficiency s Remarks
glass

zero point three
Round hole 1 IR ps Ablation vertical hole, collapse
Edge < 20 μ M
one point six
1. Mature spectroscopic scheme
Can improve efficiency again
Liter;
2. Various taper holes are available
To achieve production.
Round hole 4.35 IR ps insertion 5.7
Runway shaped hole 0.8x11 IR ps insertion 5
Runway shaped hole 14.24x6.24 IR ps insertion 9
Square hole 9.3 IR ps insertion 7.4
zero point seven
Round hole 0.5 IR ps insertion 6
Circular hole 2 IR ps insertion 16
one point three five
Circular hole 0.5 IR ps insertion 11
Circular hole 2 IR ps insertion 30
1 Laser 1 Germany
2 Spectroscopes and Optical Components 1 China
3 scanning galvanometers 2 China
4 Scene Mirrors 2 China
5 chillers 1 China
6 Software 1 China
1 set of 7 linear motors in China
1 set of 8 electric modules in China
9 Industrial Computer 1 China
10 monitors 1 Great Wall
2D linear platform
High precision marble pedestal
• High precision
Repetitive accuracy: ± 0.002mm
Straightness: ± 0.005mm
• Using grating ruler feedback
L Motion axis
Using precision ball screws
Positioning accuracy: ± 0.02 mm
• Repetitive accuracy:
Installation requirements
External dimensions (length x width x height) (mm) 2000 x 2040x2000
Floor size (length x width x height) (mm) 3450 x 3240 x 2500
Mass (kg) 4500
Environmental temperature: (ºC) 20-25
Environmental humidity: 40% to 70%
Power requirement 380V/50Hz AC 3P
Machine power (KW) 15
Compressed air (MPa) 0.6-0.8
Operating noise (dB) < 100
Power demand
source
compressed air

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.