• Horizon Chemical Mechanical Polishing Machine in Wafer Chip Manufacturing Equipment
  • Horizon Chemical Mechanical Polishing Machine in Wafer Chip Manufacturing Equipment
  • Horizon Chemical Mechanical Polishing Machine in Wafer Chip Manufacturing Equipment
  • Horizon Chemical Mechanical Polishing Machine in Wafer Chip Manufacturing Equipment
  • Horizon Chemical Mechanical Polishing Machine in Wafer Chip Manufacturing Equipment
  • Horizon Chemical Mechanical Polishing Machine in Wafer Chip Manufacturing Equipment

Horizon Chemical Mechanical Polishing Machine in Wafer Chip Manufacturing Equipment

After-sales Service: Provided
Warranty: 12 Months
Driven Type: Pneumatic
Product Name: Horizon Chemical Mechanical Polishing Machine
Advantage 1: Entire Machine Has a Compact Structure
Advantage 2: Real-Time Process Control
Customization:
Gold Member Since 2023

Suppliers with verified business licenses

Jiangsu, China
QA/QC Inspectors
The supplier has 1 QA and QC inspection staff
R&D Capabilities
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  • Overview
  • Product Description
  • Application
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
Horizon Chemical Mechanical Polishing Machine in Wafer Chip Manufacturing Equipment

Mainly used for all flattening process requirements in wafer chip manufacturing equipment, such as IMD, STI, ILD, BPSG, contact, metal line, etc., while supporting flattening processes in new fields such as TSV and MEMS.

Product Features

  • The entire machine has a compact structure, saving space for the purification plant;
  • Can achieve "dry in and dry out" of wafers;
  • Online endpoint detection method, real-time process control;
  • The control software is completely autonomous and controllable.
 
Application

Horizon Chemical Mechanical Polishing Machine in Wafer Chip Manufacturing Equipment

Exhibition & Customers

Horizon Chemical Mechanical Polishing Machine in Wafer Chip Manufacturing EquipmentHorizon Chemical Mechanical Polishing Machine in Wafer Chip Manufacturing EquipmentJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Horizon Chemical Mechanical Polishing Machine in Wafer Chip Manufacturing Equipment
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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