8-Inch Silicon Wafer Semi Chip Standard Chip High End Lithography Machine Equipment

• Customization: Available
• Function: High Temperature Resistance
• Demoulding: Automatic
• Model NO.: Himalaya-22
• Condition: Used
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Desktop
• Driven Type: Electric
• Mould Life: >1,000,000 Shots

Product Description

Product Description

1, Main technical indicators of Canon i4

1) Chip type: 8-inch silicon wafer;
2) Chip thickness: SEMI standard;
3) Exposure resolution: 0.35 μ M;
4) Uniformity of light intensity: ≤ ± 2%;
5) Exposure intensity: ≥ 6000 W/m2;
6) Workbench step accuracy: 3 σ ≤ 50nm;
7) Mask size: 6 inches; 
8) Type of photoresist: I-line special photoresist;
9) Photoresist thickness:<1.5 μ M;
10) Capacity: 1 hour; (55pcs/h)
11) Testing (instrument) methods: microscope, CDSEM, equipment self-test;
12) Engraving accuracy<0.075um (equipment self-test);
3, Equipment appearance inspection
Number inspection item inspection result
The surface of the equipment is clean and free from collision marks, surface scratches, rusted screws, unclear handwriting, cable cracking, and other phenomena. 
Plastic parts should have no bubbles, cracks, or deformations. 
The structural components and control components should be intact and free from mechanical damage. 
4. The complete set of components, spare parts, and accessories is complete and assembled correctly. 
The appearance of the 5 welded components is uniform and flat, and the welds are firm and beautiful. 
The connection position of the 6 screws is correct, the connection is firm, and there is no looseness, skewness, or sliding buckle. 
7. The coating is firmly bonded, with beautiful and consistent colors, and no scratches, spots, or other obvious defects. 
The nameplate markings of the 8 devices are complete. 
The markings and explanatory drawings of the 9 circuit connection ends are complete, the wiring is neat, and the wiring of the moving parts is reasonable. 
The movement of the 10 moving parts is smooth and the stroke is correct.
4, Equipment technical index testing (with testing method attached)
notes

Classification		ltem		Specificatior
1	llumination Perfomance	Intensity	NA0.63 so0.65	=6000 W/m2
		Uniformity	NA0.63 sg0.65	5+2.0%
		Masking Blade   Accuracy	Theta	≤3000 ppm
			Gray Zone	Range≤90 um
			Tota	≤290 um
		Light Integrator- Dose Accuracy		1.5%
		Open Frame	No Particles in Light Path	No Spot
2	Auto Focus eveling Performance	Levelin g	3 sigma Focus	3 sigma≤0.08 um
		Repeatability (Static)	3 sigma X	B sigma≤6 ppm
			3 sigma Y
		Leveling Repeatability (Dynamic)	3 sigma Focus	3 sigma≤0.1 um
			3 sigma X3 sigma Y	3 sigma≤7 ppm
		Uneven focus	XY Incline V	≤4 ppm
		Uneven focus Til   OFF (TSOC)	Incline V	≤6 ppm
3	XY Stag	Orthogonality	Ortho	≤±0.5ppm
		Scaling	XY
		Stepping Accuracy-    N-STEP	3 sigma XX 3 sigma YY	≤50 nm
		Reticle (Field Rotation	Average Y vernier	≤30nm

		Reticle Rotation     Repeatability	Y vemier	≤30nm
4	Pre-Alignment	Mechanical PA    Accuracy	3 sigma Xl    3 sigma Xr    3 sigma Yl    3 sigma Yr	3 sigma ≤70 um
5	Flatness	Chuck   Flatne ss		≤1,5 um
5	Lens Performance	Absolute Distortion NA 63 Sigma 65	DX	DX≤50nm
			DY	DY≤50nm
		Resolution	L/S	≤0.35 um
		Depth of Focus	0.35um L/S and 0.5um    SO	≤0.7um
		mage Field Deviation	0.35um L/S and 0.5um    SO	0.5
6	ALFC	Measuremen Repeatability	Left Side	3 Sigma≤0.2um
7	Auto Alignmen Accurac	Broad Band Accuracy        Mode 3	XY	m|+3 Sigma≤75 nm
8	Baseline Stability	BLC stablity B-BN	BIcX BIc Y	3 sigma≤30 nm
9	ThroughPut		30 shots.(AGA)	≥55wafers /hou
10	Reliability	Reticle Change       Reliability	50 Reticle load/unload	no error
		Wafer Feeder   Reliability	500 wafers each

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.