Automatic Modular 3D X-ray Offline CT Inspection System for Semicon

• Customization: Available
• After-sales Service: 1 Year
• Function: Abrasion Resistance, Lubrication, High Temperature Resistance, Anti-Corrosion, Anti-Cold
• Model NO.: HMLA-XT-160
• Demoulding: Automatic
• Condition: New
• Certification: ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Pneumatic
• Mould Life: <300,000 Shots
• Geometric Magnification: 2100X
• Total Magnification: >23000X
• Detail Resolution: up to 0.35 Micron
• Submicron X-ray Tube: Open Micron Tube,Transmission Tube Head,170-Degree
• Maximum Tube Voltage: 160kv
• Maximum Power: 20W
• Maximum Measurement Range: 410mm×410mm
• Control Platform: X-ray Automatic Navigation System Enables Internal
• Transport Package: Wooden Case
• Trademark: none
• Origin: China

Product Description

Product Description

 

Brief Introduction
The 3D X-ray inspection system MirXT-160 is specially tailored for wafer technology, SMT, packaging inspection, semiconductor and laboratory applications. The equipment is used to detect solder/tin voids and bonding wires generated in the SMT/semiconductor manufacturing process in the electronic industry. Packaging defects such as offset, wire cross short circuit, flip-chip solder ball virtual soldering, flip-chip solder ball short circuit, wire breakage, wire detachment, etc.
 

Functions and Feature

1. Modular design, user-customized system

2. Multi-axis motion control system enables clear detection from different angles

3. Automatic real-time navigation chart and x-ray image navigation chart function

4. Specially designed OVHM module, the detector can rotate 360 degrees horizontally and tilt 70 degrees

5. Ultra-high-speed, high-definition CT images

6. Product process programming, with automatic detection function, 5-axis interpolation function, visual CNC detection, and unlimited point editing

7. Digital real-time image processing technology, professional configuration HDR image enhancement technology functions

8. Maximum tube voltage: 160KV, maximum power 20W

9. Geometric magnification up to 2100x, total magnification up to 23000x

10. The smallest detection capability can reach: 0.35 micron

11. ovhm technology High magnification bevel detection


 

Technical Specifications

 

Geometric magnification	2100x
total magnification	>23000X
detail resolution	Up to 0.35 micron
Submicron X-ray tube	Open micron tube,transmission tube head,170-degree radiation angle, collimation function
Maximum tube voltage	160KV
Maximum   power	20W
target	Non-toxic carrier tungsten target and can be rotated for multiple uses
Vacuum system	Oil-free low vacuum pump+turbo molecular vacuum pump
FPD	1536*1536pixel
Control platform	X-ray automatic navigation system enables internal and external navigation
The overall structure Maximum	High-precision anti-vibration,5-axis synchronous drive
Maximum measurement range	410mm×410mm
Maximum workpiece size/weight	510mm×510mm/5kg
Detector wnw triangle view rotation	Adjustable viewing angle 70°,n×360°
Tilt/swivel device	Tilt 70°and rotate n×360°,the maximum workpiece weight is 5kg

X-ray imaging

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