Chinese Made Ultrasonic Scanning Microscope

• Customization: Available
• After-sales Service: 1 Year
• Warranty: 1 Year
• Model NO.: HMLA-GRD-CS3
• Max Scanning Speed: 1000mm/S
• Max Resolution: 36000×36000
• Ultrasonic Transducer Adaptation Range: 1-400MHz
• X/Y Detection Range: 400mm×400mm
• Z-Focus Stroke: 100mm
• Shock-Proof Device: Marble Shockproof Device
• Transport Package: Wooden Case
• Specification: 0*0*0
• Trademark: none
• Origin: China

Product Description

Product Description

 

Product profile:

GRD-CS3 ultrasound scanning microscopy is a highly practical non-destructive testing instrument. The product mainly uses high frequency ultrasonic wave to detect all kinds of semiconductor devices and materials, which can detect the defects of pores, cracks, inclusions and stratification inside the sample, and show them in a graphical way. During scanning, no damage to the sample and not the sample performance. Therefore, it is widely used in semiconductor devices and packaging detection, material detection, IGBT power module product testing and other occasions.

Technical Feature:

1.Support A, B, C scan, transmission scan, multi-layer scan, JEDEC tray scan, thickness measurement and other scanning modes.
2.The position, shape and size of the internal defects of the measured can be displayed in an image way, and the size and area statistics of the defects can be performed, as well as the automatic calculation of the percentage of the defects in the measured area.
3.The scanning shaft uses linear motor and grating ruler feedback, which can obtain higher motion accuracy, with the highest resolution of 0.1μm.
4.It is suitable for rapid scanning analysis of a single device, and can also be batch placed samples for synchronous defect identification, and quickly screen out unqualified products.
5.The ultrasound system has a wide bandwidth range, and the compatible ultrasound probe frequency can be made from 1-300 MHz.
6.The NDTS ultrasonic scanning and detection software equipped with the equipment is independently developed by our company. The Chinese operation interface is easy to read, and the functions can be continuously upgraded according to customer needs.

Applications:

1.Semiconductor devices and packaging detection:
Discrete devices (IGBT / SiC), ceramic substrate, plastic sealing IC, photoelectric devices, microwave power devices, MEMS devices, inverted chip, stacked Stacked Die, MCM multi-chip module, etc.
2.Material testing:
Ceramics, glass, metal, plastic, welding parts, water-cooled radiator, etc.
3.IGBT power module product testing:
Realize the nondestructive detection of internal interface and structural defects of IGBT module, accurately find the problems in IGBT module materials and process, screen unqualified products, and promote the improvement of packaging quality of IGBT module.

Parameter:
 

Ultrasonic transducer adaptation range	1~400MHz
X / Y detection range	400mm×400mm
Z-focus stroke	100mm
Maximum scanning rate	1000mm/s
Sampling rate	1G/s,1.5G/s,3G/s
Maximum resolution	36000×36000
Repeat alignment accuracy	±0.1
Scan-axis positioning accuracy	±0.5
Software	NDTS2.0
Minimum scanning area	1.3mm×0.98mm
Shockproof device	Marble shockproof device

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