Wafer Bonding Equipment for Hot Pressing Bonding/Eutectic Bonding/Melt Bonding

• After-sales Service: Provide
• Warranty: 12 Months
• Product Name: Wafer Bonding Equipment
• Application: for Hot Pressing Bonding
• Certification: ISO
• Condition: New
• Model NO.: JYJ-200A/JYJ-200B/JYJ-200C
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

  

JYJ-200A

It is mainly used for SiC seed crystal

preparation, high-temperature hot pressing

bonding of dissimilar metal materials and non

metal materials, hot pressing diffusion welding

of aluminum alloy components, stainless steel

and ceramic materials, as well as wafer level

bonding and hot pressing forming process of

other powder materials.

JYJ-200B

It is mainly used for hot pressing bonding,

eutectic bonding, melt bonding, silicon silicon

direct bonding, polymer bonding, etc. it has

the characteristics of high bonding pressure,

good temperature uniformity, uniform

pressure, semi-automatic, etc.

JYJ-200C

It is mainly used for wafer level packaging of

micro systems such as RF, inertial, photoelectric and

signal transmission, and wafer level homogeneous

heterogeneous bonding of high-end MEMS, high

performance logic devices, engineering substrates

and laminated solar cells. It can form bonding

interfaces between heterogeneous materials at low

temperature and achieve color bonding strength.

 

Application

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.