• Laser Assisted Bonding Welding Lab for Advanced Package
  • Laser Assisted Bonding Welding Lab for Advanced Package
  • Laser Assisted Bonding Welding Lab for Advanced Package
  • Laser Assisted Bonding Welding Lab for Advanced Package
  • Laser Assisted Bonding Welding Lab for Advanced Package
  • Laser Assisted Bonding Welding Lab for Advanced Package

Laser Assisted Bonding Welding Lab for Advanced Package

Condition: New
Warranty: 12 Months
Automatic Grade: Automatic
Installation: Vertical
Driven Type: Electric
Product Name: Laser Assisted Bonding Welding Lab
Customization:
Gold Member Since 2023

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Jiangsu, China
QA/QC Inspectors
The supplier has 1 QA and QC inspection staff
R&D Capabilities
The supplier has 1 R&D engineers, you can check the Audit Report for more information
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  • Overview
  • Product Description
  • Application
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Feature 1
High Reliability and Stability
Feature 2
Advanced Package Laserassisted Bonding
OEM/ODM Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
Laser Assisted Bonding Welding Lab for Advanced Package
Product Features
  • Higher weld strength

  • High uniformity laser beam shaping

  • Customized laser spot size

  • Real-time feedback system with pressure sensing and temperature

  • Process traceability

  • Customized laser process development for new applications

Technical specification
Laser wavelength 808nm/1064nm
Laser power 500-4000W
Spot Type Linear, rectangular, round custom flat top spot
Welding Temperature 150-300ºC, real-time feedback adjustment
Solder selection SAP solder/alloy solder/solder paste solder
Application


Laser Assisted Bonding Welding Lab for Advanced Package

Exhibition & Customers

Laser Assisted Bonding Welding Lab for Advanced PackageLaser Assisted Bonding Welding Lab for Advanced PackageJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Laser Assisted Bonding Welding Lab for Advanced Package
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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