This series comprises special cleaning machines for wafers after polishing. They integrate automatic loading and unloading systems, double-sided PVA scrubbing, mega-sonic cleaning, spin drying & N2 blow drying, and other units. They also enable wet/dry-in and dry-out functions, and are suitable for cleaning various semiconductor wafers after polishing.
Features
1. Cleaning process
Pre-cleaning/double-sidedbrushing/rinsing/megasonic/blow drying/spin drying
2. Type of brush
PVA brush, double-side scrubbing
3. PLC control system
Touch screen operation
4. Automatic system
Robot arm transportation, cassette in/out, wafer dry inand dry out
Audited Supplier 
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