Automatic Laser Cutting Machine for Circuit Boards, Packaging IC Carrierboard Precision Cutting

• Customization: Available
• After-sales Service: Provided
• Warranty: Provided
• Laser Classification: Semiconductor Laser
• Condition: New
• Product Name: Automatic Laser Cutting
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Product Features

• Select laser, fixture and stage according to actual product processing needs

• One machine for drilling, cutting and scribing, reducing customer costs

• Support full cutting / half cutting process

• Single and double head, online, offline, automatic loading and unloading options, strong flexibility

• Support multi-feature CCD visual positioning, with automatic compensation function

Application

PCB/FPC/RF/Touch ID/Type-C/TF-Card
/LGA/BGA and other ty pes of modules,
circuit boards, packaging IC carrier
board precision cutting, slotting

 

Technical specification
Laser wavelength	355nm, 532nm, 1064nm, etc.
Laser pulse width	Nanosecond, picosecond, femtosecond
Laser power	UV30W Max, Green60W Max
Laser Life	>20,000 hours
Product thickness	≤2mm
Cutting Range	350×400mm, can be customized
Processing speed	800mm/s(Max.)
Platform Accuracy	Repeat ≤1μm, positioning ≤3μm
Positioning accuracy	±5μm

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.