| Customization: | Available |
|---|---|
| After-sales Service: | Provide |
| Condition: | New |
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
| Maximum substrate size | 610mm×630mm (24"× 24") |
| Minimum substrate size | 300mm×300mm (12"× 12") |
| Substrate thickness | 0.1mm~5.0mm |
| Analyze | 4μm/4μm |
| Resolution | 200nm |
| Linewidth accuracy | ±0.4μm |
| Depth of focus | ±200μm (AutoFocus) |
| Alignment accuracy | ±2μm@610mm×630mm |
| Capacity | <42s/pcs @ 610mm×630mm & 100mj/cm²&Each piece of four-point counterpoint X |
| Imaging material | photoresistance or high sensitivity dry film |
| Light source spectrum | 405±5nm |
| Exposure energy | 10-1000mj/cm² or higher |
| Application | hard board, soft board, soft and hard combined board,Wafer |
| Data entry | Gerber274X, Gerber274D, DXF |
| Single power supply | AC380V-50HZ-15KW(main equipment) three-phase five wire |
| Overall dimension(L×W×H) | (Drum line)6500×1000×1500 ,DI equipment)3500×1745×2050,(Feed/discharge port + mechanical arm) 1000×1745×2050 |
| Room temperature/humidity | 22ºC±2ºC, 40%-60%(non-condensation) |
| Basic growth and contraction management | fixed growth and contraction, automatic growth and contraction, segment growth and contraction |
| StampFunctions | date, time, serial number, expansion and contraction coefficient, etc. |
| Data entry | ODB++ |
DPS-02 Product advantage
High resolution optical lens improves line quality
Automatic optical focusing integration technology to overcome the uneven thickness of the board.
Advanced air float platform technology
Single table standard model
| Wafer size | 100/150/200/300mmWafer(selectable) |
| Analyze | 2μm L/S |
| Linewidth accuracy | ±10% |
| Depth of focus | 20μm |
| Front engraving accuracy | 1μm |
| Imaging material | photoresist(PR) |
| Light source spectrum | 405±5nm |
| capacity | 40WPH@12inch |
| Exposure energy | 20-1000mj/cm² or higher |
| Total power of light source | 6W |
| Data entry | GDSII, Gerber274X, ODB++ |
| Applicable technology | Frontal exposure,The right side Alignment |
| Single power supply | AC380V-50HZ-8KW(Primary equipment) |
| Weight per unit | 2000kg |
| Overall dimension(L×W×H) | 1810mmL×1700mmW×2105mmH |
| Temperature/humidity | 22ºC±1ºC, 40%-60%(non-condensation) |
| OverlayCompensation | fixed Overlay,Auto Overlay |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
){kind=link}