Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms

Product Details
Customization: Available
Function: Laser Grooving
Demoulding: No
Gold Member Since 2023

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  • Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
  • Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
  • Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
  • Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
  • Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
  • Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
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  • Overview
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
Himalaya-6688-4
Condition
New
Certification
ISO
Warranty
12 Months
Automatic Grade
Automatic
Installation
Desktop
Driven Type
Electric
Mould Life
Laser Warranty for One Year
Transport Package
Complies with International Logistics Standards
Specification
1400 x2400x 2440 (including tricolor light)
Trademark
Himalaya
Origin
China
Production Capacity
1

Product Description


 
Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms

This machine is a specialized equipment for semiconductor wafer Laser Grooving, designed as a fully automatic model, and adopts a plug type (customized special) material box feeding method. The equipment integrates high-performance, high-power, and ultra fast lasers, providing long-term stable and high-quality laser output performance. It is equipped with high-precision robotic arms and motion platforms to ensure accurate processing.
Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms

Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
Exhibition & Customers

Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion PlatformsLaser Grooving Machine Equipped with High-Precision Robotic Arms and Motion PlatformsJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 


 

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