Trim & Form System Semiconductor Equipment for Product Cutting/ Bending/Forming/Separation After Plastic Sealing

• Condition: New
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Product Name: Auto Molding Equipment
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• OEM/ODM Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Main Features

Equipment function: product cutting, bending, forming, and separation after plastic sealing;

Applicable packaging: SOP/SSOP and other series;
Punching power: servo motor upper power -3~5T;
Cutting speed: 60-100 strokes per minute (SPM: 60-100)
Separation speed: 40-60 strokes/minute (SPM: 40-60)
Control system: PLC (Omron)
Operating system: touch screen+buttons, displaying UPH/SPM punching count;
Feeding structure: rotating double magazine feeding;
Material receiving mechanism: material tube receiving (tube mounted), automatic tube arrangement compatible with material box bulk receiving;
Safety protection system: The equipment is equipped with leakage protection devices, emergency stop button devices, and all main protective doors are equipped with SENSOR protection devices;
Optional 1: CCD visual detection device;
Option 2: MES system networking function.

 

Advantage

1. Using imported raw materials and advanced equipment for manufacturing and testing, with high equipment accuracy and stable performance;

2. Customized according to needs, with strong wear resistance, long service life, guaranteed quality, and worry free after-sales service.

 

Sample Display

 

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.