High End Ceramic Punching Equipment with High Precision Laser Processing System

• Function: High End Ceramic Punching Equipment
• Demoulding: High End Ceramic Punching Equipment
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Desktop
• Model NO.: Himalaya-6688-8-2
• Driven Type: Electric
• Mould Life: Laser Warranty for One Year
• Transport Package: Complies with International Logistics Standards
• Specification: 1400 x2400x 2440 (including tricolor light)
• Trademark: Himalaya
• Origin: China
• Production Capacity: 1

Product Description

Product Description

Introduction:
High precision laser processing system: galvanometer+cutting head, integrated advantages
Ø Dual workstation processing, improving efficiency
Fully automatic loading and unloading, reducing manual involvement
Imported laser with stable power output to ensure consistency in processing technology
Automatic recording of system processing performance data and visual display of operating status
Modular design for easy debugging and maintenance
Compatibility design to meet the processing requirements of different specifications of ceramic chips
One person can operate multiple machines, saving labor
Processing principle:
After being focused by an optical system, the laser beam is irradiated on the surface of the material, and its high-density energy causes the material to instantly flash
Dramatic heating forms a melting zone, which is assisted by blowing to remove the molten material and form micropores.
Serial number, name, model, specification, quantity (set), original manufacturer and place of origin
1. Four axis gantry platform travel: 250 × 700 1 Clan
2 fiber laser infrared 2 imported
3 industrial computer Weidakang 1 domestically produced
4. Laser processing system galvanometer+cutting head 2 imported
5. Customization of material transfer components and 1 family
6 CCD component inlet 2 inlet
7 Software PLC 1 OMRON
8 monitors, 17 inch LCD, 1 Great Wall
Customization of 9 racks and housing families: 1 family
10 fixture families customization 2 families
11 loading and unloading platforms, 2 families for customization
12 domestically produced smoke purifiers 1 domestically produced
13 Domestic chillers 1 Domestic

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.