Jiangsu, China
Business Type:
Trading Company
Main Products:
Number of Employees:
11
Year of Establishment:
2019-09-12
Plant Area:
83 square meters
Average Lead Time:
Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months
Off Season Lead Time: 1-3 months
Die Bonder, Wire Bonding manufacturer / supplier in China, offering High Precision Wafer Thinning Machine Grinding Equipment Manufacturers, Advanced Automatic IC Chip Programming Machine with CCD Technology, High-Efficiency Tube and Tray IC Chip Programming System and so on.
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Since 2023
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