Jiangsu, China
Business Type:
Trading Company
Main Products:
Number of Employees:
11
Year of Establishment:
2019-09-12
Plant Area:
83 square meters
Average Lead Time:
Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months
Off Season Lead Time: 1-3 months
Die Bonder, Wire Bonding manufacturer / supplier in China, offering Innovative High Precision Grinding Equipment for Wafer Thinning, Precision Wafer Grinding Machines for Efficient Thinning Processes, High Precision Wafer Thinning Machine Grinding Equipment Manufacturers and so on.
Diamond Member
Since 2023
Suppliers with verified business licenses
Audited Supplier
