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Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type:

Trading Company

Main Products:

Die Bonder , Wire Bonding , Laser Marking(ID IC Wafer) , Laser Grooving , Laser Cutting , ...

Number of Employees:

11

Year of Establishment:

2019-09-12

Plant Area:

83 square meters

Average Lead Time:

Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months

OEM/ODM Service

Overseas Agent / Branch

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Die Bonder, Wire Bonding manufacturer / supplier in China, offering High Precision Vacuum Plasma Cleaning Machine Omnidirectional Surface Cleaning for Semiconductor, Factory Wholesale Price Dqx Series Radio Frequency Plasma Cleaning Machine, High-Efficiency Tabletop Vacuum Microwave Plasma Cleaning Machine Mwd12 and so on.

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Mr. Jack

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Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu Himalaya Semiconductor Co., Ltd.

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	Business Type:	Trading Company
	Main Products:	Die Bonder , Wire Bonding , Laser Marking(ID IC Wafer) , Laser Grooving , Laser Cutting , ...
	Number of Employees:	11
	Year of Establishment:	2019-09-12
	Plant Area:	83 square meters
	Average Lead Time:	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

BV Serial NO. :

MIC-ASI2342144 Report Verification | Read Free Report

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!

"Intelligent equipment + Internet industry", We focus on core industrial fields such as semiconductor, EMS, to provide customers with high-end intelligent equipment, intelligent production line upgrading, digital factory, intelligent manufacturing consulting, and other products and services.

Our main products: Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting(Glass Ceramics Wafers Packaging, Laser Internal Modification Machine Si /Sic Wafe, Laser Internal Modification Machine Lt/Ln Wafer, Laser Annealing Machine for Si/Sic, Automatic Dicing Saw Machine(Wafer Packaging)), Automatic Silicone Dispensing Equipment.

Trade Capacity

International Commercial Terms(Incoterms):

FOB, CIF, CFR

Terms of Payment:

LC, T/T, PayPal, Western Union

Average Lead Time:

Peak Season Lead Time: 3-6 months, Off Season Lead Time: 1-3 months

Number of Foreign Trading Staff:

2

Overseas Agent/Branch:

Yes

Export Year:

2021-12-01

Export Percentage:

51%~70%

Main Markets:

Europe

Nearest Port:

Shenzhen Port

Import & Export Mode:

Have Own Export License

Partner Production Capacity

Factory Address:

Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

R&D Capacity:

ODM, OEM

No. of R&D Staff:

1

No. of Production Lines:

1

Annual Output Value:

Above US$100 Million

Company Show

Exhibition

6 Items

Workshop

6 Items

Packaging

11 Items

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