High-Speed Testing System Discrete Device Test System Qt-6000

• After-sales Service: Provided
• Condition: New
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Model NO.: QT-6000
• Product Name: High-Speed Testing System
• Feature 1: High-Speed Test
• Feature 2: Lcr Accurate Capacitance Test
• OEM/ODM Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Discrete Device Test System QT-6000

QT-6000 test system is applied to test small and medium-sized power triode diode MOS-FET(IGBT) and wafer etc. updated system can cover built-in capacitance(DC+CAP) and Scanbox test.

 

The characteristics of:

· High-speed test, UPH>40K

· One for two to achieve 100% FT+QA parallel test

· Advanced capacitor high-speed test program to achieve CAP+DC same-station test

· Built-in UIS test program to achieve DC+UIS same-station test

· LCR accurate capacitance test, the minimum test capacitance value is 100fF

 

Major Technical Parameters

 

Measurement Accuracy	Current: <0.5% Reading + 0.05% FullRange + 1.5nA Voltage: <0.5% Reading + 0.05% FullRange + 1.5mV Capacitance: 0.5% Reading + 0.05% FullRange + 10fF
Technical indicator	Max Current/Voltage30A /1200V Capacitance Measurement range:0.2-300pF(BIAS voltage range 0~80V,1MHz) LCR Measurement Range:0.1pF-0.1uF(DC Bias:0-30V, 1MHZ)
DPI	16 bit  ADC/DAC
Waveform	Built-in oscilloscope

Application

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.