Ultra Fast Laser High-Speed Drilling Machine Customized Ultra-Fast Picosecond / Femtosecond Lasers

• After-sales Service: Provided
• Condition: New
• Warranty: 12 Months
• Automatic Grade: Manual
• Installation: Vertical
• Driven Type: Pneumatic
• Product Name: Ultrafast Laser High Speed Drilling Machine
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Product Features

• Customized ultra-fast picosecond / femtosecond lasers with low thermal effects

• Self-developed drilling process technology which meets different process requirements

• Excellent hole formation quality, high real roundness and small taper

• Support visual positioning of various features

Application

Mainly used for rapid drilling of chip
inductor raw ceramics, TSV, TGV, HDI,
advanced package loading board, and
other applications, as well as various
polymer films

Technical specification
Laser power	10-100W
Processing speed	8000 holes/sec (hole diameter, hole spacing related)
Applicable material thickness	≤0.5mm
Bore Accuracy	±5%
Position accuracy	±10μm
Stage travel	300×300mm(customizable)
Automation configuration	Stacked cassette, four robots automatic loading and unloading

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.