High End Fully Automatic Fpca/PCBA/Pi/Pet Laser Cutting Equipment

• Function: High Temperature Resistance
• Demoulding: Automatic
• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Model NO.: Himalaya-18
• Installation: Desktop
• Driven Type: Electric
• Mould Life: >1,000,000 Shots
• Production Capacity: 1111

Product Description

Product Description

Applicable scope:

Suitable for FPCA, PCBA, PI/PET, covering film, thin film and other materials
Precision cutting and slotting
Equipment features:
Adopting independently developed control software, capable of multi panel cutting and self assembling
Functions such as dynamic zoom and expansion compensation enable high-precision machining.
Adopting high-precision motion system, scanning galvanometer and visual positioning system, and
High precision (all marble structure).
Adopting offline single workbench working mode.
1. Excellent beam quality
Beam quality is one of the important indicators for measuring a laser, and good beam quality means
In order to achieve finer processing quality, faster processing speed, and wider applications, the A series laser can deliver high-quality beams of M2<1.3.
2. Extremely high laser stability
By optimizing the design of the laser resonant cavity, the A series laser has extremely high laser power stability, with a power instability of less than ± 2%. Therefore, even materials that are highly sensitive to lasers can achieve consistent marking effects when processed with an A laser.
3. By optimizing the design of laser resonant cavities
The A series laser has extremely high laser power stability, and the power instability is less than ± 2%. Therefore, even materials that are highly sensitive to lasers can achieve consistent marking effects when processed with an A laser.
4. Multi parameter output
Laser is rapidly replacing traditional processing methods in multiple industries due to its unparalleled advantages, but complex and high demand applications require targeted laser output parameters. As a laser platform, A can achieve combined output of different laser wavelengths, powers, and pulse widths through multiple redundant designs, maximizing the needs of applications in various industries.

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.