Factory Price High Standard UV Laser Marking Machine for Food, PVC Pipe, Medicine Packaging Material

• After-sales Service: Provided
• Warranty: Provided
• Laser Visibility: Visible
• Applicable Material: Metal
• Laser Wavelength: Fiber Laser
• Laser Classification: Semiconductor Laser
• Model NO.: EP-15-THG-S
• Product Name: UV Laser Marking
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

 

Product Description

Brief Description

1. Marking of electronic products' LOGO, model, place of origin and so on.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.

Features:

1. With cold laser processing and small heat-affected zone, it can achieve high quality processing.
2. Wide applicable materials range can compensate for the shortage of infrared laser processing ability.
3. With good beam quality and small focusing spot, it can achieve superfine marking.
4. High marking speed, high efficiency, and high precision.
5. No consumables, low cost and low maintenance fee.
6. The overall machine has stable performance, supporting long-term operation.

Specifications:

Machine model	EP-15/25/30-THG-S
Laser wavelength	355nm
Laser power	4W / 7W / 10W /15W / 25W
Min. marking line width	10µm-15µm
Marking speed	250 characters/sec
Marking scope	100*100mm
Standard lens	F160
Pulse repetition frequency	10-200kHz
Cooling mode	Water cooling
Power supply	AC 220V, 50Hz, 16A
Total power consumption	≤1.5kW
Overall dimension	800mm*950mm*1630mm

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.