Frame Laser Marking Machine with Integrated Post Label Detection System

• Function: Frame Laser Marking
• Demoulding: No
• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Model NO.: Himalaya-6688-4
• Installation: Desktop
• Driven Type: Electric
• Mould Life: Laser Warranty for One Year
• Transport Package: Complies with International Logistics Standards
• Specification: 1400 x2400x 2440 (including tricolor light)
• Trademark: Himalaya
• Origin: China
• Production Capacity: 1

Product Description

Product Description

 

Name
Fully automatic frame laser marking system
Model
Device Functions
Mark the serial number or QR code on the lead frame for marking
Application object
The frame adopts stacked incoming materials, with a partition paper in the middle

Equipment Introduction
1. Automatic loading and unloading
2. Can adapt to a maximum frame size of 300 * 100mm
3. Adopting a dual loading and unloading system design to improve the efficiency of automatic loading and unloading
4. QR code recognition by the reading code system
5. Can be equipped with a visual positioning system to improve marking accuracy
6. Can communicate with customer MES data
7. Marking machine: single marking machine; Can be equipped with optical fiber, green light, ultraviolet light

Name
Laser marking system for disk mounted crystal oscillator chips
Model
Device Functions
Automatic loading and unloading of plate mounted products, positioning and marking
Application object
Crystal oscillators and chips placed in trays
Equipment Introduction
1. Loading position: The tray falls from top to bottom into the conveying system
2. Blanking position: The tray is collected from bottom to top
3. Equipped with a visual positioning system to improve marking accuracy
4. Marking machine: can be equipped with single or double head marking machines
5. The laser can be equipped with optical fibers, green light, and ultraviolet light
1. Applied to semiconductor chips and various memory cards; 2. Fully automatic operation, pallet loading and unloading;
3. Double laser marking to improve efficiency;
4. Single chip positioning to improve marking accuracy;
5. Integrated post label detection system;
6. Comply with SEMI standards and support SECS/GEM communication protocol;
Leader frame markers:
Materials: pure copper, silver plated, nickel plated, gold plated;
Depth: adjustable;
QFN cutting:
Material: multi-layer copper+resin; Total thickness: 820um;
Copper thickness: 200um;

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.