Simple Film-Forming Coating Equipment for Cu, Al, Co, Cr, Au, AG, Ni, Ti and Other Metal Materials

• Condition: New
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Product Name: Electron Beam Evaporation Coating Equipment
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• OEM/ODM Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Small Electron Beam Evaporation Coating Equipment

The equipment adopts vertical front door structure and cluster layout. It can be equippedwith evaporation sources for metals and various organic materials, and can evaporatesilicon wafers of` various specifications. Equipped with precise alignment system, the coating is stable and the film repeatability is good.

The equipment can accurately, evenly and controllably evaporate organic light-emitting materials or metal materials on to the substrate, it has the advantages of simple film-forming.high film purity and compactness. The repeatability and stability of the process can beguaranteed by the full-automatic film thickness real-time monitoring system. It is equipped with self melting function to reduce the dependence on the operator's skills.

The equipment can be applied to Cu, Al, Co, Cr, Au, Ag, Ni, Ti and other metal materials.and can be coated with metal film, dielectric film, lMD film, ete, It is mainly used in semiconductor industry, such as power devices, semiconductor rear packaging substrate coating, etc.

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.