• High Precision Visual System Laser Internal Modification Equipment for Sic / Si Wafer
  • High Precision Visual System Laser Internal Modification Equipment for Sic / Si Wafer
  • High Precision Visual System Laser Internal Modification Equipment for Sic / Si Wafer
  • High Precision Visual System Laser Internal Modification Equipment for Sic / Si Wafer
  • High Precision Visual System Laser Internal Modification Equipment for Sic / Si Wafer
  • High Precision Visual System Laser Internal Modification Equipment for Sic / Si Wafer

High Precision Visual System Laser Internal Modification Equipment for Sic / Si Wafer

After-sales Service: Provided
Condition: New
Certification: ISO
Warranty: 12 Months
Automatic Grade: Automatic
Product Name: Semiconductor Equipment
Customization:
Gold Member Since 2023

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Jiangsu, China
QA/QC Inspectors
The supplier has 1 QA and QC inspection staff
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The supplier has 1 R&D engineers, you can check the Audit Report for more information
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Feature 1
Guaranteed Quality
Feature 2
Customized According to Needs
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
High Precision Visual System Laser Internal Modification Equipment for Sic / Si Wafer
Laser Internal Modification Machine for SIC / Si wafer

Equipment features:
1. Specially designed laser system
2. Excellent cutting effect
3. Fully automated production
4. High precision visual system; Automatic alignment and autofocus; High precision motion platform
5. Compatible with 4/6 inch production
6. SECS GEM standard interface


Application scope: Silicon MEMS sensors, pressure sensing chips, microphones, temperature measurement chips, RFID, biochips, and other silicon substrate wafer laser cutting

High Precision Visual System Laser Internal Modification Equipment for Sic / Si Wafer

 
Exhibition & Customers

High Precision Visual System Laser Internal Modification Equipment for Sic / Si WaferHigh Precision Visual System Laser Internal Modification Equipment for Sic / Si WaferJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

High Precision Visual System Laser Internal Modification Equipment for Sic / Si Wafer
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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