Integrated Multi-Functional Patch Solidifying Machine/Die Bonder Chip Bonding Machine

• After-sales Service: Provided
• Condition: New
• Speed: High Speed
• Precision: High Precision
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Product Name: Semiconductor Equipment
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

 

 

Clip Bonder High-speed Clip Bonding System

placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ;

Up to 20Clips / Cycle;

Prebond & Posbond function;

Solder patch & solder paste inspection function;

High precision linear drive die bond head;

High precision clip punching system;

The multi dispensing independent control system provides more accurate glue control, equipped with glue detection, with automatic glue filling function;

Multiple configurations meet various market demands, as well as customization according to special demands;

Freely match various types of reflow equipment.

 

 

Advantages of Die Attach
DA801/DA1201 can be configured;
Placement accuracy: ±10-25μm@3σ;
Theta placement accuracy: ±1°@3σ;
Stable force control system;
Dual dispensing system, support dipping / jetting / writing epoxy process.

Advantages of Clip Bond
Placement accuracy: ±50μm@3σ;
Theta placement accuracy: ±3°@3σ;
Reducing packaging size;
Improving thermal conductivity;
As the parasitic resistance is reduced, the electrical characteristics are improved.

Advantages of Vacuum Reflow
Using industrial control embedded control system;
Providing a replaceable heating module;
Flux solder paste automatic recovery system;
Intelligent nitrogen monitoring and controlling system;
Stepwise vacuum design, which can be divided into 5 steps maximally;

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.