• High End Semiconductor Packaging Process IC Chip Marking Machine
  • High End Semiconductor Packaging Process IC Chip Marking Machine
  • High End Semiconductor Packaging Process IC Chip Marking Machine
  • High End Semiconductor Packaging Process IC Chip Marking Machine
  • High End Semiconductor Packaging Process IC Chip Marking Machine

High End Semiconductor Packaging Process IC Chip Marking Machine

Function: High Temperature Resistance
Demoulding: Automatic
Condition: New
Certification: ISO
Warranty: 12 Months
Automatic Grade: Automatic
Customization:
Gold Member Since 2023

Suppliers with verified business licenses

Jiangsu, China
QA/QC Inspectors
The supplier has 1 QA and QC inspection staff
R&D Capabilities
The supplier has 1 R&D engineers, you can check the Audit Report for more information
to see all verified strength labels (14)
  • Overview
  • Product Description
Overview

Basic Info.

Model NO.
Himalaya-32
Installation
Desktop
Driven Type
Electric
Mould Life
>1,000,000 Shots
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description

During the semiconductor packaging process, frame baking, electroplating, rib cutting, marking, and other processes all require load-bearing tools for material transfer and production. Different processes have different load-bearing tools, and after cutting, a single product is carried using a Tray tray, followed by marking processes. The TRAY drive is mainly designed in the following style:

High End Semiconductor Packaging Process IC Chip Marking MachineApplication field:
The tray single chip series products suitable for packaging in the semiconductor industry are labeled.
Printing materials: epoxy resin (plastic sealing material), metal heat dissipation cover, bare core (silicon wafer)
Main features:
Mark the specific string corresponding to the serial number, product name, batch number, logo, QR code, and other relevant information at the specific location of the plastic sealed IC; Modular design, meeting different process requirements by replacing hardware such as lasers;
Compatibility design to meet different size specifications of products;
External dimensions: 2400mm x 1370 x 1800mm (L * W * H)
(Height does not include tricolor lights)
High End Semiconductor Packaging Process IC Chip Marking MachineExplanation: In the above figure, 1, 2, and 3 are the pre marking waiting position, marking processing position, and post marking detection position, respectively; When processing, two mirrors are processed simultaneously to ensure the processing effect and
Efficiency. Visual positioning detection uses high-precision line scanning cameras and line scanning light source systems to ensure pre marking positioning accuracy and post marking detection accuracy, and marking positioning
During inspection, the material tray is clamped by two sets of side push cylinders to ensure that the tray does not move. During the marking process, there is blowing and vacuuming before and after the marking position,
Ensure the effectiveness of dust extraction while also ensuring good marking results.
High End Semiconductor Packaging Process IC Chip Marking MachineFeatures/highlights
Compatibility
1. Standard device tray compatible external dimensions: 322.6mm * 135.9mm * 7.62mm (L * W * H)
2. The width of the material transportation track can be changed according to the size of the customer's tray
• Class 6 (ISO) machining environment matching cleanroom standards, • Self developed system software with interactive functions such as code reading, uploading, and information downloading
Automatic recording of system processing performance data and intuitive display of operating status
Equipped with an independent dust removal system to isolate harmful substances and dust particles
Equipped with one set of electrostatic elimination device and dust removal device after laser marking
Power automatic correction, high process stability, reduces the risk of product damage caused by abnormal power
Marking depth and line width can be adjusted
Compatible with other device font libraries and custom font libraries
The selling price is lower than that of imported equipment of the same type
• Anti error and PostVision functions, timely control of defective continuous production
Equipped with Sorting function to achieve defect sorting
Independent dual LASER system, FOCUS automatic and quick adjustment
Self developed systems and software can upgrade device functions according to customer actual needs
Resin materials
Vector filling: epoxy resin front marking
High End Semiconductor Packaging Process IC Chip Marking Machine• Metal coating materials
Vector filling: surface marking of the coating
High End Semiconductor Packaging Process IC Chip Marking Machine• Bare core
High End Semiconductor Packaging Process IC Chip Marking MachineProcessing performance:
1. Laser light source: green light
2. Non distortion printing area: 180mm × 320mm
3. Line width: 0.06-0.08mm (adjustable)
4. Minimum character height: 0.35mm (adjustable)
5. Printing depth: 0.005-0.035mm (adjustable)
6. Seal array accuracy: The deviation of the entire disk is within (± 0.1mm)
Laser imported, stable and reliable performance
Average power fluctuation<1.5%
Single pulse energy fluctuation<2%
Domestic high-precision digital galvanometer
Strong anti-interference ability
Ensure delivery time and service
Import F- θ Field mirror
Small temperature drift and stable focus
Laser unit
High End Semiconductor Packaging Process IC Chip Marking MachineIndependent dust removal and purification system
The filter cartridge filtration and pulse back blowing dust cleaning system ensure the discharge of dust and harmful gases. The drawer type dust device is convenient for discharge, avoids repeated replacement, and meets environmental protection requirements.
High End Semiconductor Packaging Process IC Chip Marking Machinesoftware
The software PLC adopts an automatic foolproof function, and when the engineer interface is not operated on time, it automatically switches to the operator interface;
The laser marking speed of this machine can reach, printing 1000mm/s and jumping to 9000mm/s;
Mechanical arm transmission, a stable and reliable transportation method;
Automatic energy measurement and energy correction
The software supports automatic alignment and centering functions;
Support NG material removal and good product correction functions
Machine scanning to replace text, automatic text alignment, fixed text width
Can recognize the QR code on the edge of the tray and call mapping for printing
Functional HANS equipment
Product compatibility 322.6mm * 135.9mm * 7.62mm (L * W * H)
-The external dimensions of the Tray disk meet JEDEC standards
Product loading method: Tray loading method
Product transportation method: Two vehicles
Laser and optical path family laser, IPG, SP
Dust removal and electrostatic removal before and after marking, as well as electrostatic removal with ion rods
Visual anti fooling function, compatible with different products
Dust removal structure: The exhaust of the dust removal machine filters out toxic gases before being discharged
The collection of product misplacement does not affect the operation of the equipment. The misplacement and detection of defective products have a mechanism to remove them and display information on the touch screen
Laser focus adjustment axis software adjustment with high accuracy
Mark the position of the product by clamping the tray with the lifting cylinder to prevent shaking
Product positioning method: high-precision line scanning camera visual precision positioning
Equipment safety protective covers and other safety measures
Light path cooling system water cooling
The printing depth can be adjusted according to customer requirements, and the handwriting is clear
Serving Chinese people with independent research and development, able to respond quickly
The software can be modified according to customer usage habits and requirements
1 set of German&China dual head laser marking components, laser wavelength optional
2 loading and unloading components, 1 set in China
3 pairs of fire detection components, 1 set in China
1 set of 4 visual camera positioning components for China visual inspection
1 set of dust removal components with 5 markings in China, including blowing and dust extraction functions
6 sets of track conveying components and 2 sets of China belt robotic arms for transmission
7 pushing components 1 set in China
1 set of 8 chillers available in China
1 set of 9-line scanning camera detection components from China
10 sets of vacuum cleaners in China, with specifications depending on smoke and dust
1 set of 11 software self-developed by China, supporting customization
12 industrial control computers, 1 set of Advantech
13 monitors 1 set DELL
14 cabinets, 1 set in China
15 sets of electrical control components in China
High End Semiconductor Packaging Process IC Chip Marking MachineName parameter remarks
External dimensions
(W * L * H) 2400mm x 1370 x 1800mm excluding tricolor lights, which are foldable
Land occupation area
(W * L * H) 3400mm x 2800 x 2300mm for reference only
Weight ≈ 2000Kg for reference only
The fluctuation of ambient temperature between 20-25 ºC is less than ± 2 ºC
Environmental humidity of 40% to 60% without condensation
Power supply:
AC 380V ± 5%/50Hz/50A; Good grounding, grounding resistance<4 ohms
Power 7KW
Compressed air 0.5~0.8MPa dual inlet: main engine air source and dust collection
Gas source (equipped with φ 10mm trachea)
Dust extraction Φ 100mm interface docking with customer's central purification system
Avoid installing vibration source VC-B near sources such as punch presses
Environmental smoke and dust Class 6 (ISO) or above
High End Semiconductor Packaging Process IC Chip Marking MachineCompatible, camera field of view: 150mm line scan mode, actual dual head laser head printing with a maximum area of 180 * 320mm, compatible with customer size requirements. The following is a case of a certain customer:
Two different sizes of ICs can be clearly identified and positioned.
High End Semiconductor Packaging Process IC Chip Marking MachineThe visual system uses an 8K line scanning camera with a single pixel accuracy of 18um, and the overall character printing accuracy is ± 0.1mm.
Here is an introduction to the visual scheme
Project parameters
Camera 8K
Lens line scan 60mm
Illumination: Ultra high brightness white coaxial light source
Ultra high brightness white line light source
Field of View (FOV) short side 150mm, long side customizable
Lens working distance (WD) 193mm
Coaxial light source working distance 110 ± 10mm
Working distance of line light source
45mm ± 10mm
35mm ± 10mm
Accuracy of single pixel: 0.018mm/pixel
The visual system consists of two parts: pre marking positioning detection (BIV) and post marking inspection (PostVision).
1. Main functional modules for positioning detection:
1. Positioning chip position (positioning accuracy of 18um)
2. Able to identify marker points on the chip for anti backtracking
3. Can detect whether it has been marked to prevent duplicate coding
4. Able to recognize the QR code on the chip
3. Introduction to detection and correction modules
2. Post press inspection main functional module, detection accuracy: 100 * 40um
1. Detect printed character breaks
2. Detect printed logo disconnection
3. Detect printing position offset and rotation with an accuracy of ± 0.1mm
4. Detect white dirt in the printing area
2. Post press inspection rendering, detected a broken line in the logo area. 1. Visual positioning of the chip's position and recognition of pins
Point, printed, recognized QR code
High End Semiconductor Packaging Process IC Chip Marking MachineImported laser for the project, domestically produced laser
Wavelength 532nm 532nm
Laser type fiber green light solid green light
Origin IPG Domestic self-developed
Power 20W, 10W, 15W, 20W, 25W, 40W
Frequency 20-500kHz 10-200kHz
Pulse energy<40uJ<300uJ-800uJ
Pulse width 1.5ns 10-80ns
Stability RMS<2%<2%
Beam quality<1.2<1.2
Advantage 1. Integrated design of fiber laser, laser
The cavity is basically maintenance free and has a slightly longer lifespan
1. Solid state laser with high pulse energy and pulse width
Adjustable, strong processing ability, compatible with different products
Product material type
2. Domestic self-developed lasers have a short lead time and are easy to maintain
protect
3. High cost-effectiveness
Disadvantages: 1. Long delivery time and high price. 1. Solid type has a lower lifespan than optical fiber, and is normal>2
10000 hours
Component and functional optional items
Laser fiber green light, solid green light
Laser power 10W, 15W, 20W
Galvanometer, Scanlabel
Expanding mirror Altechna, Nanjing wavelength, Yina
Changjing Nalens Nanjing Wavelength
Code readers Keinz SR1000, SR2000
Post press inspection\
Sorting\
QR code detection and printing: Print or detect QR codes based on Mapping information
Font library editable and customizable font library
 

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now