High Marking Speed 3W UV Laser Marking Machine for Electronic Products Logo

• After-sales Service: Provided
• Warranty: Provided
• Laser Visibility: Visible
• Applicable Material: Metal
• Laser Wavelength: Fiber Laser
• Laser Classification: Semiconductor Laser
• Model NO.: UV-3C
• Product Name: UV Laser Marking
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

 

Product Description

Brief Description

1. Marking of electronic products' LOGO, model, place of origin and so on.
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.

Features:

1. Applicable to a wide range of materials.
2. Good beam quality, small focused laser spot, enabling super-fine marking.
3. Small heat-affected zone, avoiding damaging the material; high yield rate.
4. High marking speed, high efficiency and high precision.
5. No consumables are required, thereby reducing cost and maintenance expenses.
6. Overall performance is stable, suitable for continuous long-time operation.
7. Rotary worktable is used for marking. 

Specification:

No.	Machine model	UV-3C
1	Laser wavelength	355nm
2	Laser power	3W / 20KHz
3	Repetition frequency	10-200KHz
4	Marking range	100mm*100mm
5	Marking line width	≤0.01mm
6	Marking depth	≤0.01mm
7	Min. character	0.06mm
8	Marking linear speed	≤7000mm/s
9	Repeatability	±0.003mm
10	Power supply requirement	220V/single-phase/50Hz/15A
11	Total power	≤1KW
12	Main machine system dimension	845x950x1630mm
13	Cooling system dimension	485x580x270mm

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.