Product Description
Suitable for processing brittle materials;
Laser dual station precision cutting, with good stability and high yield;
Having a high-precision visual positioning system and multi station collaborative work;
Fully automated loading, unloading, and cutting, with simple and convenient operation;
We have a self-developed system and a Chinese operating interface.
Product (Sample)
Material: Plain glass
Incoming wafer size: ≤ 8 inches
Thickness: 0.1mm~0.7mm, thickness deviation
<± 0.01mm
Technical Principles
Under the action of a high-intensity ultra short pulse laser beam, the Gaussian laser beam is compressed to the diffraction limit through a special optical system, with a focused beam diameter of less than 3um and extremely high peak power density. In an instant, tiny plasma modified channels are formed inside the transparent material, and then the material is etched in an acid solution to form holes with a diameter greater than 1um by amplifying the modified channels in the material. Advanced Laser Control Theory Based on Position Triggering (PSO Control)
The system can accurately control the distance between laser pulses and solve the problem of uneven laser pulse emission caused by platform speed.
Technical advantages:
High dimensional accuracy
High processing efficiency
Good processing consistency
Name, Unit, Parameter, Remarks
True roundness (um)<1 before corrosion
Position degree (um)<1 before corrosion
Shape and dimensional tolerance (um)<2 before corrosion
Collapse edge (um)<2 before corrosion
Cone angle (°)>70 with a plane as the reference
Note:
This standard is calculated based on T ≤ 0.6 ± 0.01mm. For products exceeding this thickness and error, the technical requirements will be negotiated separately based on the actual achievable situation;
This standard is based on cutting circular holes, and the technical requirements for other non circular hole products are negotiated separately based on the actual achievable situation;
This efficiency is based on a thickness of 0.6mm and a diameter of φ Calculate based on a 0.05mm circle, and negotiate based on the actual achievable situation for other thicknesses or graphic products.
Laser China
Guanglu China
Cutting module China
Sports platform China
Mobile Module China
Control System China
Software China
Visual System China
Pneumatic components China
Electronic components China
Sensing System China
Name, Unit, Parameter, Remarks
Efficiency per S 1000 dual head
Yield% 97 Whole machine production yield (defect performance:
Scratches, automated debris, etc.)
Platform repeated positioning accuracy um ± 1
Platform positioning accuracy um ± 2.5
CPK ->1.33
Cutting range mm ≤ 205 * 205
Equipment weight T<4.8
Field service requirements
External dimensions (mm) 2390x2000x2000
Effective usage size (mm) 4390x4000x3000
Weight (Kg) 4500
Temperature: (ºC) 20-25 (7X24/h air conditioned)
Humidity: 20% to 70%
Power supply AC 220V/50Hz 32A single-phase
Power (KW) 5
Compressed air (bar) 6-10
Vacuum pressure (bar) -10 to -6
Working noise (dB) < 100
consume
Electric main
Qi mainly
Exhibition & Customers
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Packaging & Shipping
FAQ
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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