• PCB X-out Laser Marking Lm Equipment for Semiconductorpackaging Boards and Electronicmodule Boards
  • PCB X-out Laser Marking Lm Equipment for Semiconductorpackaging Boards and Electronicmodule Boards
  • PCB X-out Laser Marking Lm Equipment for Semiconductorpackaging Boards and Electronicmodule Boards
  • PCB X-out Laser Marking Lm Equipment for Semiconductorpackaging Boards and Electronicmodule Boards
  • PCB X-out Laser Marking Lm Equipment for Semiconductorpackaging Boards and Electronicmodule Boards
  • PCB X-out Laser Marking Lm Equipment for Semiconductorpackaging Boards and Electronicmodule Boards

PCB X-out Laser Marking Lm Equipment for Semiconductorpackaging Boards and Electronicmodule Boards

Condition: New
Warranty: 12 Months
Automatic Grade: Automatic
Installation: Vertical
Driven Type: Electric
Product Name: PCB X-out Laser Marking
Customization:
Gold Member Since 2023

Suppliers with verified business licenses

Jiangsu, China
QA/QC Inspectors
The supplier has 1 QA and QC inspection staff
R&D Capabilities
The supplier has 1 R&D engineers, you can check the Audit Report for more information
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  • Overview
  • Product Description
  • Application
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
PCB X-OUT
Feature 1
High Reliability and Stability
Feature 2
Line Scan CCD Detection
OEM/ODM Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
PCB X-out Laser Marking Lm Equipment for Semiconductorpackaging Boards and Electronicmodule Boards
Product Features
  • Automatic recognition of front-end process marks. Direct access to Mapping files for laser marking

  • Line scan CCD detection and identification system

  • Material number processing information storage and recording function

Technical specification
Laser wavelength 532nm
CCD positioning accuracy ±5μm
Output power 0-10W adjustable
Laser Marking Depth 0.05-0.4mm adjustable
Line width 30μm
Repeatability ±3μm
CCD positioning 5 megapixels
CCD video detection 20 megapixels
Application


PCB X-out Laser Marking Lm Equipment for Semiconductorpackaging Boards and Electronicmodule Boards

Exhibition & Customers

PCB X-out Laser Marking Lm Equipment for Semiconductorpackaging Boards and Electronicmodule BoardsPCB X-out Laser Marking Lm Equipment for Semiconductorpackaging Boards and Electronicmodule BoardsJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

PCB X-out Laser Marking Lm Equipment for Semiconductorpackaging Boards and Electronicmodule Boards
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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