• Chemical Mechanical Polishing Equipment for Mainstream 14nm/28nm Logic Processes
  • Chemical Mechanical Polishing Equipment for Mainstream 14nm/28nm Logic Processes
  • Chemical Mechanical Polishing Equipment for Mainstream 14nm/28nm Logic Processes
  • Chemical Mechanical Polishing Equipment for Mainstream 14nm/28nm Logic Processes
  • Chemical Mechanical Polishing Equipment for Mainstream 14nm/28nm Logic Processes
  • Chemical Mechanical Polishing Equipment for Mainstream 14nm/28nm Logic Processes

Chemical Mechanical Polishing Equipment for Mainstream 14nm/28nm Logic Processes

After-sales Service: Provided
Warranty: 12 Months
Driven Type: Pneumatic
Product Name: Chemical Mechanical Polishing Equipment
Advantage 1: Dual Independent Processes
Advantage 2: Transmission Systems
Customization:
Gold Member Since 2023

Suppliers with verified business licenses

Jiangsu, China
QA/QC Inspectors
The supplier has 1 QA and QC inspection staff
R&D Capabilities
The supplier has 1 R&D engineers, you can check the Audit Report for more information
to see all verified strength labels (14)
  • Overview
  • Product Description
  • Application
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

Product Description
Chemical Mechanical Polishing Equipment for Mainstream 14nm/28nm Logic Processes

 Meet all complex planarization process requirements in IC manufacturing. Suitable for mainstream 14nm/28nm logic processes, covering STI/ILD/IMD, FinFET/Metal gate/W/Cu and other processes.

Product Features

  • Layout dimensions (length * width * height) 5.70m * 2.80m * 2.70m
  • 2×2Polishing table and dual cleaning station
  • Dual independent processes and transmission systems
  • The grinding head and grinding table correspond in opposition, ensuring better process consistency( WIW & WTW <3%)
  • The output rate has significantly increased compared to international imported equipment WPH >60
 
Application

Chemical Mechanical Polishing Equipment for Mainstream 14nm/28nm Logic Processes

Exhibition & Customers

Chemical Mechanical Polishing Equipment for Mainstream 14nm/28nm Logic ProcessesChemical Mechanical Polishing Equipment for Mainstream 14nm/28nm Logic ProcessesJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Chemical Mechanical Polishing Equipment for Mainstream 14nm/28nm Logic Processes
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now