Product Description
This machine is equipped with a wafer splitting device for brittle materials such as 2 "~8" LED/SIC/glass/ceramic. The laser processed wafer is supported by the receiving platform as a reference, supplemented by the splitting action of the blade lifting to separate the chips. During the splitting process, the CCD automatically corrects and takes photos to detect the splitting effect, ensuring that the equipment can quickly and accurately split; And achieve unmanned production, manual only needs to perform intermittent loading and unloading of material frames.
Loading and unloading mechanism
1.1 Automatic correction of positioning track for material pieces
1.2 25 layer standard cassette
1.3 Chip gripper device mechanism
1.3.1 Automatic detection of abnormal gripper material retrieval
1.4 Standard 6-inch iron ring
1.4.1 Appearance dimension tolerance of iron ring<0.3mm
1.5 wafer patch positioning within ± 5mm
1.6 wafer mounting angle within 30 degrees
1.7 The maximum allowable deformation of the iron ring is less than 1 mm
2 CCD automatic alignment function
2.1 Automatic edge finding and alignment of fragments with a permissible radius of less than 2 mm
2.2 Automatic θ Angle alignment servo+teeth
Automatic splitting position correction with a minimum wheel separation rate of 15 ″ 3
3.1 Automatic correction and correction accuracy of splitting position: 0.005mm
4-blade mechanism
4.1 Feedback from the servo system of the blade lifting mechanism, accuracy: 1 μ M
4.2 CCD Crossline Assisted Chopper Reference Adjustment
whole
4.3 Splitting blade parallelism adjustment and top thread adjustment
4.4 Hardness HRC65 after splitting hardening treatment
5 receiving institutions
5.1 Receiver opening and closing step+lead screw repeatability within ± 0.002mm
5.2 Platform hardening treatment hardness HRC56
6 CCD modules
6.1 Wide angle CCD: 1 set of high-definition camera
6.2 CCD: 1 set of high-definition camera
6.3 One set of wide-angle lenses
6.4 CCD lens 2 1 set
6.5 Visual Lighting
6.5.1 Infrared blue integrated backlight source 2 pcs
6.5.2 Lower light source (blue) 2 pcs
6.5.4 One light source brightness controller
6.6 CCD lateral movement step+lead screw movement accuracy: 0.002mm
6.7 CCD vertical autofocus step+screw movement accuracy of 0.002mm
7 Hammer modules
7.1 Hammer force controller 1 pcs
1 Automatic mode/manual mode
1.1 The manual mode function can be switched, and manual splitting operations can be performed separately
1.2 Automatic mode function
2. Main functions of the software
2.1 Interface display can display the image of the homework window at a magnification of 1-4
2.2 Automatic alignment of splitting initiation point (fragment size will affect its functionality)
2.3 Automatic position/angle correction for splitting
3 Other auxiliary functions
3.1 Password graded protection restrictions to prevent operator misoperation
3.2 Move the mouse cursor to select the desired image by directly clicking on the cursor
3.3 The width inspection screen of the receiver is equipped with a ruler to inspect the width of the receiver
3.4 Hammer setting can be set to enable/disable, and software can set the force
3.5 Check the parallelism of the splitting blade by moving the CCD left, center, and right points for visual inspection
3.6 Check the parallelism of the receiving platform by moving the CCD left, center, and right points for visual inspection
Chip specifications, grain specifications, average operating time per chip, hourly production capacity (chip), monthly production capacity (22 hours/day, 28 days/month)
4 "2110 (533 * 254um) 250s 14.4 pieces 14.4 * 22 * 28=9187
4 "06A (102um * 125um) 695s 5.2 pieces 14.4 * 22 * 28=3203
1 X-Y worktable stroke: 105mmX105mm Maximum speed: 110mm/sec Linearity: ± 5um Repetitive positioning accuracy: ± 2um Ball screw+servo motor
2. Z-axis rotation angle: 120 ° Repetitive positioning accuracy: ± 10 arc-sec Rotation speed: °/6sec Servo motor
3-crack F-axis stroke: 60mm Speed: 50mm/sec Repetitive positioning accuracy: ± 1um Movement resolution: 1um Ball screw+servo motor
4. Splitting blade material: SK steel Blade width: 165mm Hard HRC65
5. SKD11 hardness HRC58
6 Workpiece fixing method: Cylinder clamping
7. The overall weight is approximately 900kg
8 Splitting efficiency 13.3x22x28 ≥ 8213 pieces/(four inches 9mil) × Taking 27Mil as an example, 270s per tablet, 22h/day, 28 days/month)
9 Average Repair
Time ≤ 12 hours/single time
10 crack appearance
Yield ≥ 99.5%
11. Equipment utilization rate ≥ 95%
After the wafer is pulled out from the cassette, it is first captured by a wide-angle CCD to obtain the appearance contour of the wafer, and then positioning and splitting can be performed
Applicable wafer size 8 inches and below wafer notes
9-inch iron ring for wafer loading and unloading, suitable for wafer thickness of 100-400 μ M (Suggestion) Suitable chip size 24 * 24~60 * 60 mils (different visual hardware can be matched according to product size)
Software Clan Splitting Machine Software Circle/Fragment Full Automatic Operation Wide angle Photography Automatic Discrimination of Full Fragment Operation, Greatly Saving Operation Time
Inspection of splitting effect, setting of hammer force compensation and length compensation in the splitting area, automatic recognition of fragments and whole pieces by wide-angle CCD, positioning of the first cutting position, barcode recording, automatic shifting, automatic saving of production records, and automatic scanning of codes for splitting parameter shifting operation
One click inspection software for knife and receiver platform, with automatic position correction and splitting mode automatic (forward splitting, reverse splitting)/manual
1 X-Y worktable stroke: 210mmX210mm
Maximum speed: 120mm/sec
servo motor
2 Rotate Z-axis
Rotation angle: 120 °
Resolution: 0.001 ° servo motor
3-split F-axis
Travel: 55mm
Speed: 50mm/sec servo motor
4 CCD motion X-axis maximum speed: 100mm/sec servo motor
5 Precision positioning lens movement axis CY/CF maximum speed: 10mm/sec
6. Edge length of receiver: 220mm, straightness: within ± 3um
7 split blade length: 220m, straightness: within ± 3um
Process Introduction:
The splitting process is to apply a certain amount of slight pressure to the product that has been laser cut along the laser path, causing the product to be excited along the path
The process of fracture at the scratch of light; The product is placed on a symmetrical support platform (the spacing between the gaps in the middle is adjustable), with high precision
Calibrate the laser cutting path position (micrometer level positioning) using the visual system, and use the split blade above the product (blade width 5um)
Quickly lift and lower, causing the product to crack and separate along the cutting path (laser scratch area).
This technology is currently widely used in various glass material shards. High positioning accuracy and effective reduction
The technological advantages of low collapse edge and solving incomplete twin crystal fracture.
4.2 Process Introduction:
Processing plan:
(1) The cleaver directly acts on the chip cutting path position, visually locating it without interfering with the cutting path
External contact;
(2) The blade width is about 6um, and the accuracy deviation is ± 3um. The flatness of the support table is about 5um
The accuracy deviation is ± 3um.
(3) From the perspective of protecting the wafer and reducing the risk of edge collapse, add a layer of 25um or more on the front of the chip
Non adhesive release protective film prevents direct contact between the blade and the cutting material, allowing the blade to act on
On the cutting path, three points are formed through the front and rear receiving platforms to bend and crack the outer area of the cutting path
The domain has almost no impact.
Partial sample effect
5.3 Machine Placement Requirements (W) 1650 × (D) 1200 × (H) 1700 (mm) (excluding signal lights)Additionally, at least 600mm should be reserved around the perimeter
Environmental requirements for use
Power demand 220V/single-phase/50Hz/10A
Environmental temperature 20-25 ºC
Environmental humidity 20% -60%
Compressed air 0.6MPa
Compressed air interface Φ 8mm
Environmental vibration requires foundation amplitude<5 μ M
Vibration acceleration<0.05G
Exhibition & Customers
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Packaging & Shipping
FAQ
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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