• Automatic Laser IC Marking Equipment Support Scanning to Replace Text
  • Automatic Laser IC Marking Equipment Support Scanning to Replace Text
  • Automatic Laser IC Marking Equipment Support Scanning to Replace Text
  • Automatic Laser IC Marking Equipment Support Scanning to Replace Text
  • Automatic Laser IC Marking Equipment Support Scanning to Replace Text
  • Automatic Laser IC Marking Equipment Support Scanning to Replace Text

Automatic Laser IC Marking Equipment Support Scanning to Replace Text

After-sales Service: Provided
Warranty: Provided
Laser Visibility: Visible
Laser Classification: Semiconductor Laser
Product Name: Laser IC Marking Equipment
Feature 1: Guaranteed Quality
Customization:
Gold Member Since 2023

Suppliers with verified business licenses

Jiangsu, China
QA/QC Inspectors
The supplier has 1 QA and QC inspection staff
R&D Capabilities
The supplier has 1 R&D engineers, you can check the Audit Report for more information
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Feature 2
Customized According to Needs
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China

Product Description

 
Product Description
Automatic Laser IC Marking Equipment Support Scanning to Replace Text

Laser IC Marking Equipment

Equipment features:


1. Support MES Mark module system
2. Mark Auto download
3. Automatic generation of printing information
4. Supports Mark 2D functionality
5. Automatically read Mapping to distinguish printing defects
6. Support LOT END printing clearance function
7. Support scanning to replace text
8. Automatic text alignment with fixed text width

 
Automatic Laser IC Marking Equipment Support Scanning to Replace Text

 

 
Exhibition & Customers


Automatic Laser IC Marking Equipment Support Scanning to Replace TextAutomatic Laser IC Marking Equipment Support Scanning to Replace TextJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Automatic Laser IC Marking Equipment Support Scanning to Replace Text
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 

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