Vacuum Eutectic Welding Furnace Vsr-20MPa with Non Damaging Plasma Technology

• Condition: New
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Vertical
• Driven Type: Electric
• Model NO.: VSR-20MPA
• Product Name: Vacuum Eutectic Welding Furnace
• Application: Brazing
• Advantage: Factory Price
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Product Description

Vacuum eutectic welding furnace VSR-20MPA
The advanced process system assisted by microwave plasma is mainly used for high reliability cavity free brazing of high-power chips and substrate substrates, using vacuum, inert, reducing atmosphere, and unique plasma technology to optimize welding quality.

Industry leading microwave plasma assisted technology
High performance vacuum eutectic reflow soldering with strong deoxidation
PLC touch screen control system or Windows control system

[Configuration Options]
Vacuum system, additional process gas path, various oxidation removal process modules, customized heating plate, additional temperature measurement thermocouple, circulating chiller, soft start and slow inflation

[Product Features]
Vacuum eutectic reflow soldering without voids
Microwave plasma assisted oxidation removal
Non damaging plasma technology
Perfect compatibility with low-temperature solder processes
Fast and accurate temperature curve control
A simple and convenient operating system
 

 

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.