Menu
Join Free
For Buyer
Inquiry Basket
Get Apps
Download App!
Explore App Exclusive Discounts
English
Menu
Post Sourcing Request
Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu, China
Business Type:
Trading Company
Main Products:
Die Bonder , Wire Bonding , Laser Marking(ID IC Wafer) , Laser Grooving , Laser Cutting , ...
Number of Employees:
11
Year of Establishment:
2019-09-12
Plant Area:
83 square meters
Average Lead Time:
Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months
OEM/ODM Service
Overseas Agent / Branch
Visit My Factory

Die Bonder, Wire Bonding manufacturer / supplier in China, offering High Precision Sells Best Semi Automatic Wafer Mounter, High Precsion Fully Automatic Wafer Mounter, Integrate The Measurement Scene Into The Workshop Production - Camel Series and so on.

Contact Supplier
Gold Member Since 2023

Suppliers with verified business licenses

Supplier Homepage Products

Product Groups

Featured List

Product Catalogs

Contact Supplier

Avatar
Mr. Jack
Deputy General Manager
Product Groups

All Products

Total 797 Products
Gallery View
List View
Slide Show
1/34
Video
Quick View
High Speed Fully Automatic Gold/Copper Wire Bonder
High Speed Fully Automatic Gold/Copper Wire Bonder
FOB Price: US $60,000-170,000 / Box
Min. Order: 1 Box
Contact Now
Video
Quick View
Fully Automatic Laser Grooving Equipment for Semiconductor Wafers
Fully Automatic Laser Grooving Equipment for Semiconductor Wafers
FOB Price: US $550,000-1,000,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Quick View
Semiconductor Fully Automatic IC Marking Machine
Semiconductor Fully Automatic IC Marking Machine
FOB Price: US $100,000-3,000,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Quick View
Fully Automatic ID Laser Marking Machine
Fully Automatic ID Laser Marking Machine
FOB Price: US $28,000-160,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Quick View
Fully Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System
Fully Automatic 8-12 Inches Wafer Marking Equipment with a Crystal Loading System
FOB Price: US $130,000-500,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Quick View
Frame Laser Marking Machine with Integrated Post Label Detection System
Frame Laser Marking Machine with Integrated Post Label Detection System
FOB Price: US $100,000-200,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Quick View
Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
FOB Price: US $620,000-1,000,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Quick View
High End Manufacturing Laser Sealing Machine
High End Manufacturing Laser Sealing Machine
FOB Price: US $68,493-136,986 / Piece
Min. Order: 1 Piece
Contact Now
Video
Quick View
High End Laser Processing Ceramic Equipment
High End Laser Processing Ceramic Equipment
FOB Price: US $200,000-2,000,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Quick View
High End Ceramic Punching Equipment with High Precision Laser Processing System
High End Ceramic Punching Equipment with High Precision Laser Processing System
FOB Price: US $200,000-1,000,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Quick View
Semiconductor Wafer Laser Stealth Cutting Equipment
Semiconductor Wafer Laser Stealth Cutting Equipment
FOB Price: US $700,000-1,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
Quick View
4/6/8-Inch Wafer Production Sic Laser Annealing Equipment with a Vacuum Cracking System
4/6/8-Inch Wafer Production Sic Laser Annealing Equipment with a Vacuum Cracking System
FOB Price: US $1,400,000-2,000,000 / Piece
Min. Order: 1 Piece
Contact Now
Video
Quick View
Automated Handling System Mobile Robots Used for Indoor Logistics Operations
Automated Handling System Mobile Robots Used for Indoor Logistics Operations
FOB Price: US $70,000-2,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
Quick View
High End Wafer ID Automatic&Manual Setting Storage Chip Automatic Detection Equipment
High End Wafer ID Automatic&Manual Setting Storage Chip Automatic Detection Equipment
FOB Price: US $500,000-2,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
Quick View
Professional High End Fully Automatic Laser Debonding Equipment with Good Stability
Professional High End Fully Automatic Laser Debonding Equipment with Good Stability
FOB Price: US $1,000,000-3,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
Quick View
High End Fully Automatic Fpca/PCBA/Pi/Pet Laser Cutting Equipment
High End Fully Automatic Fpca/PCBA/Pi/Pet Laser Cutting Equipment
FOB Price: US $100,000-2,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
Quick View
High End Fully Automatic IC Reel Packaging Equipment for Semiconductor Industry Process
High End Fully Automatic IC Reel Packaging Equipment for Semiconductor Industry Process
FOB Price: US $1,000,000-2,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
Quick View
High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device
High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device
FOB Price: US $100,000-1,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
Quick View
Tgv High-End Precision Laser Drilling Machine Suitable for Processing Brittle Materials
Tgv High-End Precision Laser Drilling Machine Suitable for Processing Brittle Materials
FOB Price: US $500,000-2,000,000 / Set
Min. Order: 1 Set
Contact Now
Quick View
8-Inch Silicon Wafer Semi Chip Standard Chip High End Lithography Machine Equipment
8-Inch Silicon Wafer Semi Chip Standard Chip High End Lithography Machine Equipment
FOB Price: US $2,000,000-4,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
Quick View
High End Semiconductor Wafer Saw Machine
High End Semiconductor Wafer Saw Machine
FOB Price: US $200,000-500,000 / Set
Min. Order: 1 Set
Contact Now
Video
Quick View
High End Semiconductor Fully Automatic Laser Ring Cutting Machine
High End Semiconductor Fully Automatic Laser Ring Cutting Machine
FOB Price: US $100,000-1,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
Quick View
High End Semiconductor Chip Fully Automatic Laser Overflow Removal Equipment
High End Semiconductor Chip Fully Automatic Laser Overflow Removal Equipment
FOB Price: US $90,000-2,000,000 / Set
Min. Order: 1 Set
Contact Now
Video
Quick View
High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
FOB Price: US $100,000-1,000,000 / Set
Min. Order: 1 Set
Contact Now

Show: 24 36 48
1 2 3 4 5 6 7 8
Hot Products China Products Chinese Manufacturers/Suppliers China Wholesale Wholesale Price Industry Sites Regional Channels Product Index Mobile Site Insights
Language Options: Español Português Français Русский язык Italiano Deutsch Nederlands العربية 한국어 日本語 हिन्दी ภาษาไทย Türkçe Tiếng Việt Bahasa Indonesia
Copyright © 1998-2024 Focus Technology Co., Ltd. All Rights Reserved.
User Agreement Declaration Privacy Policy