Product Description
AOI
basic function
1. Wafer ID automatic&manual setting storage
2. Wafer detection area can be selected, supporting ROI
3. Wafer size can be optionally set
4. FOUP ID automatic reading, box opening mapping scanning
5. XYZ table software control interface
6. Multi lens&light source parameter settings
data output
1. The yield result of the current test is displayed, and if it exceeds the threshold (which can be set), it will be displayed in red
2. Display defect data in each region, label and cruise locate wafer defects, and calculate distribution intervals based on defect size statistics
3. Wafer detection data archiving, supporting export.
4. Export die mapping to save in txt format
Bar Code data reading reads the barcode data on open cassette and determines storage
Work log management supports Error logs; Alarm history; Job history query
Repetitive error in yield (scanning the same wafer three times): defect die error<10 pieces (note: based on online production data, non abnormal production pieces with a single wafer yield ≥ 95%)
Leakage rate ≤ 0.5%
Inspection rate ≤ 3%
The difference in AOI detection yield between different machines is less than 0.2% (using discs with a yield of ≥ 95% for testing)
Detection accuracy (sensitivity of bright field defect detection)
2x objective lens defect ≥ 9.7um
3.5 magnification objective defect ≥ 5um
5x objective lens defect ≥ 3.5um
10x objective lens defect ≥ 1.5um
Single wafer yield repetition error (single wafer re scanned 3 times) < ± 0.05% (Note: Based on the data after online mass production review, for non abnormal mass production wafers with a single Wafer yield ≥ 95%)
Mean time between failures ≥ 1000 hours (downtime>1 hour is considered a failure)
Incoming inspection specification size Wafer 8 inches (diameter 200mm), 12 inches (diameter 300mm)
Exhibition & Customers
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Packaging & Shipping
FAQ
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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