Fully Automatic ID Laser Marking Machine

Product Details
Customization: Available
Function: Laser ID Marking
Demoulding: No
Gold Member Since 2023

Suppliers with verified business licenses

Audited Supplier

Audited by an independent third-party inspection agency

QA/QC Inspectors
The supplier has 1 QA and QC inspection staff
R&D Capabilities
The supplier has 1 R&D engineers, you can check the Audit Report for more information
to see all verified strength labels (14)
  • Fully Automatic ID Laser Marking Machine
  • Fully Automatic ID Laser Marking Machine
  • Fully Automatic ID Laser Marking Machine
  • Fully Automatic ID Laser Marking Machine
  • Fully Automatic ID Laser Marking Machine
Find Similar Products
  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
Himalaya-6688-2
Condition
New
Certification
ISO
Warranty
12 Months
Automatic Grade
Automatic
Installation
Desktop
Driven Type
Electric
Mould Life
Laser Warranty for One Year
Transport Package
Complies with International Logistics Standards
Specification
1400 x2400x 2440 (including tricolor light)
Trademark
Himalaya
Origin
China
Production Capacity
1

Product Description

Product Description
 
Fully Automatic ID Laser Marking Machine

1. Applied to semiconductor wafer ID marking, compatible with products under 12 inches;
2. Fully automatic operation, equipped with FFU purification system;
3. Suitable for common wafer materials such as silicon, silicon carbide, gallium arsenide, etc; 4. Comply with SEMI standards and support SECS/GEM communication protocol;
Hard marking: Point diameter: 90um; Depth 300um
Fully Automatic ID Laser Marking MachineFully Automatic ID Laser Marking MachineFully Automatic ID Laser Marking MachineFully Automatic ID Laser Marking Machine
 
Exhibition & Customers

Fully Automatic ID Laser Marking MachineFully Automatic ID Laser Marking MachineJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

Fully Automatic ID Laser Marking Machine
FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 



 

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now
Contact Supplier