High End Semiconductor Chip Fully Automatic Laser Overflow Removal Equipment

• Function: High Temperature Resistance
• Demoulding: Automatic
• Condition: Used
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Model NO.: Himalaya-25
• Installation: Desktop
• Driven Type: Electric
• Mould Life: >1,000,000 Shots

Product Description

Product Description

1. Customer products
1) The product is shown in the following diagram
2) Loading and unloading of material boxes
2. Remove overflow around the product heat sink
3. Marking in designated areas
1. The product adopts visual positioning.
2. Use the positioning holes on the frame to position the product.
Control system Scanlab galvanometer square head+control card, Windows
laser
Wavelength 1064nm
Power 20W
Laser processing range 50 * 50mm
Cooling method: air cooling
System repeated positioning accuracy ± 0.02mm
Support file formats dxf, plt
Power of smoke and dust filtration system 2.2KW
Power supply single-phase 220V/50Hz
External dimensions (mm) 640 × five hundred and forty × one thousand two hundred and twenty-two
Weight (kg) 105
Maximum air volume (m3/h) 265
Maximum negative pressure (mbar) 230
Rated power (kW) 2.2
Voltage (V/Hz) 220/50&60
Control protection external control&digital display pressure&alarm output
Noise (dB) 70 ± 2
Interface specification intake 2 × Ø 50; Exhaust Ø 75
Filter cartridge material PTFE coated filter cartridge
Filter area (m2) 4.0
Filter barrel filtration efficiency ≥ 99% 0.3 µ m
Manual cleaning method (automatic beep reminder)
Working environment: 10 ºC~30 ºC (with air conditioning installed and controlled indoor temperature environment stable ± 2 ºC)
Transportation environment -25 ºC~55 ºC
Working humidity 45%~75%
Power demand 1P AC220V, 50/60HZ, 30A
Grid fluctuations < ± 10%
The grounding wire of the power grid meets the national standard requirements of the computer room
Compressed air pressure: 0.5-1.2MPa, flow rate ≥ 50L/min (Compressed air should be dehydrated and degreased before passing through an air dryer and entering the equipment)
Places to avoid use
a. Places with a lot of garbage, dust, and oil mist;
b. Places with high vibrations and impacts;
c. Places that can reach drugs and flammable and explosive materials;
d. Places near high-frequency interference sources;
e. A place prone to condensation

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.